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Article

A Novel Dry Selective Isotropic Atomic Layer Etching of SiGe for Manufacturing Vertical Nanowire Array with Diameter Less than 20 nm

by
Junjie Li
1,2,*,
Yongliang Li
1,
Na Zhou
1,
Guilei Wang
1,2,*,
Qingzhu Zhang
1,3,
Anyan Du
1,
Yongkui Zhang
1,
Jianfeng Gao
1,
Zhenzhen Kong
1,
Hongxiao Lin
1,
Jinjuan Xiang
1,
Chen Li
1,2,
Xiaogen Yin
1,2,
Yangyang Li
1,2,
Xiaolei Wang
1,
Hong Yang
1,
Xueli Ma
1,
Jianghao Han
1,
Jing Zhang
4,
Tairan Hu
4,
Tao Yang
1,
Junfeng Li
1,
Huaxiang Yin
1,2,
Huilong Zhu
1,2,
Wenwu Wang
1,2,* and
Henry H. Radamson
1,2,5
add Show full author list remove Hide full author list
1
Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China
2
Microelectronics Institute, University of Chinese Academy of Sciences, Beijing 100049, China
3
State Key Laboratory of Advanced Materials for Smart Sensing, General Research Institute for Nonferrous Metals, Beijing 100088, China
4
College of Electronic and Information Engineering, North China University of Technology, Beijing 100144, China
5
Department of Electronics Design, Mid Sweden University, Holmgatan 10, 85170 Sundsvall, Sweden
*
Authors to whom correspondence should be addressed.
Materials 2020, 13(3), 771; https://doi.org/10.3390/ma13030771
Submission received: 16 January 2020 / Revised: 1 February 2020 / Accepted: 3 February 2020 / Published: 7 February 2020

Abstract

Semiconductor nanowires have great application prospects in field effect transistors and sensors. In this study, the process and challenges of manufacturing vertical SiGe/Si nanowire array by using the conventional lithography and novel dry atomic layer etching technology. The final results demonstrate that vertical nanowires with a diameter less than 20 nm can be obtained. The diameter of nanowires is adjustable with an accuracy error less than 0.3 nm. This technology provides a new way for advanced 3D transistors and sensors.
Keywords: vertical nanopillar; atomic layer etching; SiGe; field effect transistor; nano device; sensor material vertical nanopillar; atomic layer etching; SiGe; field effect transistor; nano device; sensor material

Share and Cite

MDPI and ACS Style

Li, J.; Li, Y.; Zhou, N.; Wang, G.; Zhang, Q.; Du, A.; Zhang, Y.; Gao, J.; Kong, Z.; Lin, H.; et al. A Novel Dry Selective Isotropic Atomic Layer Etching of SiGe for Manufacturing Vertical Nanowire Array with Diameter Less than 20 nm. Materials 2020, 13, 771. https://doi.org/10.3390/ma13030771

AMA Style

Li J, Li Y, Zhou N, Wang G, Zhang Q, Du A, Zhang Y, Gao J, Kong Z, Lin H, et al. A Novel Dry Selective Isotropic Atomic Layer Etching of SiGe for Manufacturing Vertical Nanowire Array with Diameter Less than 20 nm. Materials. 2020; 13(3):771. https://doi.org/10.3390/ma13030771

Chicago/Turabian Style

Li, Junjie, Yongliang Li, Na Zhou, Guilei Wang, Qingzhu Zhang, Anyan Du, Yongkui Zhang, Jianfeng Gao, Zhenzhen Kong, Hongxiao Lin, and et al. 2020. "A Novel Dry Selective Isotropic Atomic Layer Etching of SiGe for Manufacturing Vertical Nanowire Array with Diameter Less than 20 nm" Materials 13, no. 3: 771. https://doi.org/10.3390/ma13030771

APA Style

Li, J., Li, Y., Zhou, N., Wang, G., Zhang, Q., Du, A., Zhang, Y., Gao, J., Kong, Z., Lin, H., Xiang, J., Li, C., Yin, X., Li, Y., Wang, X., Yang, H., Ma, X., Han, J., Zhang, J., ... Radamson, H. H. (2020). A Novel Dry Selective Isotropic Atomic Layer Etching of SiGe for Manufacturing Vertical Nanowire Array with Diameter Less than 20 nm. Materials, 13(3), 771. https://doi.org/10.3390/ma13030771

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