Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization
Abstract
:1. Introduction
2. Structure Design and Working Principle
3. Theoretical Model
4. Analysis of Structural Parameters and Simulation
4.1. Gap between Cap and Working Electrodes
4.2. Width of the Sealing Ring
4.3. Resonant-Mode Simulation
5. Device Fabrication
6. Experimental Results
6.1. Experimental Setup
6.2. Characterization Results
7. Conclusions
Supplementary Materials
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Structural Parameters | Value |
---|---|
2 µm | |
250 µm | |
Thickness of the structure layer | 40 µm |
9 µm | |
Length of the working electrodes | 635 µm |
Gap between shielding electrode and | 15 µm |
75 µm | |
Number of working electrodes | 8 × 2 |
Width of driving electrodes | 9 µm |
Length of driving electrodes | 635 µm |
Number of driving electrodes | 6 × 2 |
Reported EFM | Year | Driving Signals | Quality Factor | Feedthrough |
---|---|---|---|---|
Riehl [8] | 2003 | DC 30 V and AC 2.5 VP | - | 19.1 mV |
Yang [11] | 2011 | DC 20 V and AC 1 VP | 60 | 13.9 mV |
Chu [12] | 2018 | DC 30 V and AC 15 VP | 11 | - |
Ling [13] | 2019 | DC 20 V and AC 1 VP | - | - |
This work | 2022 | DC 5 V and AC 0.05 VP | 5738 | 4.2 mV |
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Liu, J.; Xia, S.; Peng, C.; Wu, Z.; Chu, Z.; Zhang, Z.; Lei, H.; Zheng, F.; Zhang, W. Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization. Micromachines 2022, 13, 928. https://doi.org/10.3390/mi13060928
Liu J, Xia S, Peng C, Wu Z, Chu Z, Zhang Z, Lei H, Zheng F, Zhang W. Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization. Micromachines. 2022; 13(6):928. https://doi.org/10.3390/mi13060928
Chicago/Turabian StyleLiu, Jun, Shanhong Xia, Chunrong Peng, Zhengwei Wu, Zhaozhi Chu, Zhouwei Zhang, Hucheng Lei, Fengjie Zheng, and Wei Zhang. 2022. "Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization" Micromachines 13, no. 6: 928. https://doi.org/10.3390/mi13060928