Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials
Abstract
:1. Introduction
2. Experimental Section
2.1. Sample Preparation and Characterizaition
2.2. Test Setup for the Cool Storage Phase-Change Process
3. Results and Discussion
3.1. Morphology of Different Samples
3.2. Temperature Profiles during the Cool Storage Phase-Change Process
3.3. Supercooling during the Solidification Process
3.4. Mechanism Analysis
4. Conclusions
Author Contributions
Funding
Conflicts of Interest
References
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No. | Sample | Deposition Time(s) |
---|---|---|
1 | CF#0s | 0 |
2 | CF#195s | 195 |
3 | CF#255s | 255 |
4 | CF#300s | 300 |
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Xu, M.; Chen, Y.-F.; Liang, J.-Y.; Mo, D.-C.; Lyu, S.-S. Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials. Appl. Sci. 2020, 10, 4202. https://doi.org/10.3390/app10124202
Xu M, Chen Y-F, Liang J-Y, Mo D-C, Lyu S-S. Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials. Applied Sciences. 2020; 10(12):4202. https://doi.org/10.3390/app10124202
Chicago/Turabian StyleXu, Mou, Yu-Feng Chen, Jian-Yang Liang, Dong-Chuan Mo, and Shu-Shen Lyu. 2020. "Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials" Applied Sciences 10, no. 12: 4202. https://doi.org/10.3390/app10124202