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Journal: Appl. Sci., 2020
Volume: 10
Number: 4202
Article:
Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials
Authors:
by
Mou Xu, Yu-Feng Chen, Jian-Yang Liang, Dong-Chuan Mo and Shu-Shen Lyu
Link:
https://www.mdpi.com/2076-3417/10/12/4202
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