Advanced Edge Intelligence Collaborative Technology over Wireless Communications
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".
Deadline for manuscript submissions: closed (15 December 2024) | Viewed by 15236
Special Issue Editors
Interests: heterogeneous network transmission; network architecture design
Interests: edge computing; privacy protection over wireless communications
Interests: edge caching; edge computing; reinforcement learning
Interests: multimedia communications; content delivery; multi-agent reinforcement learning
Interests: edge intelligence; AI communication
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The combination of artificial intelligence and edge computing gives birth to edge intelligence. Edge intelligence helps to solve the key problem of artificial intelligence landing in the "last mile". It has broad application prospects in the industrial Internet of Things, smart cities, unmanned driving, epidemic prevention and control, and other fields, and has attracted high attention from governments, industry, and academia. Specifically, how to effectively carry out the model training and reasoning of artificial intelligence in the resource-limited edge network is the current international frontier academic hotspot. With the 10 billion level of edge device networking in the future and the continuous upgrading of edge device computing power, it has become one of the most potent ways to achieve AI model training and reasoning at the edge by using various kinds of collaboration, such as cloud-end collaboration, edge-end collaboration, cloud-edge end collaboration, and end-end collaboration. Additionally, it is still in the early stage of development, there are still many frontier problems to be solved, and research opportunities and challenges coexist.
In order to promote the research and application of edge intelligence and report the latest achievements and progress in the architecture, models, algorithms, application practices, and other aspects of edge intelligence in a timely, centralized, and comprehensive manner, Electronics plans to publish the column "Advanced Edge Intelligence Collaborative Technology over Wireless Communications" in the second issue of 2023, hoping to provide a platform for experts and scholars in related fields to exchange, cooperate, and publish the latest frontier scientific research achievements, promoting the deep integration of academia and industry. Experts, scholars, and researchers in relevant fields are welcome to contribute actively!
The topics are listed as follows:
- Collaborative privacy protection in wireless networks;
- Federal learning and privacy protection;
- Credibility driven in collaborative game optimization;
- Cooperation caching optimization;
- AoI optimization for computation offloading;
- Multi-agent reinforcement learning;
- Federal learning incentive mechanism;
- Federated learning and cloud edge collaboration;
- Intelligent-distributed drone video processing;
- Wireless network optimization for advanced edge intelligence;
- Advanced edge intelligence for immersive communications;
- Advanced edge intelligence in emerging applications, such as the Internet of things, autonomous vehicle systems, intelligent reflecting surfaces, and virtual reality systems.
Prof. Dr. Changqiao Xu
Dr. Tengfei Cao
Dr. Hao Hao
Dr. Xingyan Chen
Dr. Han Xiao
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- edge computing
- wireless network
- federal learning
- intelligent network
- collaborative optimization
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue polices can be found here.