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(Ultra)Wide-Bandgap Semiconductors for Extreme Environment Applications

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: 31 May 2025 | Viewed by 852

Special Issue Editors


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Guest Editor
School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
Interests: wide bandgap semiconductor; gallium nitride semiconductor; gallium oxide semiconductor; irradiation power electronics; extreme environment applications

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Guest Editor
School of Microelectronics, Xidian University, Xi'an 710071, China
Interests: GaN power device; beta-Ga2O3 power device; ferroelectric FETs; neuron device

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Guest Editor
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
Interests: wide bandgap semiconductor; power semiconductor; radiation mechanism; high temperature applications; extreme environment applications

Special Issue Information

Dear Colleagues,

Wide-bandgap and ultrawide-bandgap semiconductors (e.g., SiC, GaN, Ga2O3, and diamond) have notable potential for applications in extreme environments, such as space radiation, weapons nuclear explosions, and ultra-high temperatures. Ultrawide-bandgap electronics operating in extreme environments allow for an evident reduction in additional control components and shielding blocks, thereby reducing the size and weight of the power electronics system. However, the current exploration and research results of wide-bandgap devices in extreme environments are relatively scattered, and there is a lack of organization to provide inspiration to the wider community. Therefore, this Special Issue aims to provide a stage and communication venue for the research results of ultrawide-bandgap semiconductor technology for extreme environmental applications.

This Special Issue welcomes, but is not limited to, manuscripts on the following topics:               

  • Material physics and defects for extreme environments (irradiation, stress, etc.);
  • Device structure and process fabrication, e.g., traditional structure and hardened design;
  • Circuit design and power applications, e.g., gate drive and switching circuits;
  • Electronic system integration and heterostructure heterogeneity;
  • Packaging and device modules;
  • Numerical simulation and modeling analysis;
  • Various extreme-environment applications, such as radiation, high and low temperatures, and extreme stress.

Dr. Feng Zhou
Prof. Dr. Hong Zhou
Dr. Xin Zhou
Guest Editors

Manuscript Submission Information

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Keywords

  • wide bandgap semiconductor
  • ultra-wide bandgap semiconductor
  • gallium nitride
  • silicon carbide
  • extreme environment applications

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Published Papers (1 paper)

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Research

9 pages, 1231 KiB  
Article
Optimizing Wide Band Gap Cu(In,Ga)Se2 Solar Cell Performance: Investigating the Impact of “Cliff” and “Spike” Heterostructures
by Shiqing Cheng, Hongmei Liu and Qiaowen Lin
Materials 2024, 17(21), 5199; https://doi.org/10.3390/ma17215199 - 25 Oct 2024
Viewed by 684
Abstract
In recent years, the efficiency of high-efficiency Cu(In,Ga)Se2 (CIGS) solar cells has been significantly improved, particularly for narrow-gap types. One of the key reasons for the enhancement of narrow-gap device performance is the formation of the “Spike” structure at the CdS/CIGS heterojunction [...] Read more.
In recent years, the efficiency of high-efficiency Cu(In,Ga)Se2 (CIGS) solar cells has been significantly improved, particularly for narrow-gap types. One of the key reasons for the enhancement of narrow-gap device performance is the formation of the “Spike” structure at the CdS/CIGS heterojunction interface. Wide-gap CIGS solar cells excel in modular production but lag behind in efficiency compared to narrow-gap cells. Some studies suggest that the “Cliff” structure at the heterojunction of wide-gap CIGS solar cells may be one of the factors contributing to this decreased efficiency. This paper utilizes the SCAPS software, grounded in the theories of semiconductor physics and photovoltaic effects, to conduct an in-depth analysis of the impact of “Cliff” and “Spike” heterojunction structures on the performance of wide band gap CIGS solar cells through numerical simulation methods. The aim is to verify whether the “Spike” structure is also advantageous for enhancing wide-gap CIGS device performance. The simulation results show that the “Spike” structure is beneficial for reducing interfacial recombination, thereby enhancing the VOC of wide-gap cells. However, an electronic transport barrier may form at the heterojunction interface, resulting in a decrease in JSC and FF, which subsequently reduces device efficiency. The optimal heterojunction structure should exhibit a reduced “Cliff” degree, which can facilitate the reduction of interfacial recombination while simultaneously preventing the formation of an electronic barrier, ultimately enhancing both VOC and device performance. Full article
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Planned Papers

The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.

Title: Investigation of irradiation characteristics of laser-lifted GaN vertical Schottky barrier diodes
Authors: Wei Qi, Feng Zhou, Teng Ma, Weizong Xu, Dong Zhou, Fangfang Ren, Dunjun Chen, Rong Zhang, Youdou Zheng, and Hai Lu
Affiliation: School of Electronic Science and Engi-neering, Nanjing University, Nanjing 210093, China

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