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Advanced 2D Nanomaterials: Characterization and Application
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Advanced 2D Nanomaterials: Characterization and Application

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Nanomaterials and Nanotechnology".

Deadline for manuscript submissions: closed (20 January 2024) | Viewed by 5918

Special Issue Editor

Dr. Song Liu

E-Mail Website
Guest Editor
Department of Mechanical Engineering, Columbia University, New York, NY, USA
Interests: 2D materials; hBN; TMDs; nanofabrication; semiconductors

Special Issue Information

Dear Colleagues,

Two-dimensional (2D) materials have attracted tremendous interest due to their unusual mechanical, electronic, optoelectronic, and topological properties. However, despite extensive developments in their application, the full potential of 2D materials has yet to be realized. To this end, cutting-edge and integrated characteristic approaches are needed to determine the unique features of these materials, showcasing the remarkable potential for fundamental science and technological applications.

This Special Issue is focused on the up-to-date characterization and application through illustrating intrinsic properties and technological advances of 2D materials. We are seeking original research papers and topical reviews on but not limited to the following aspects:

  • Advanced functional 2D materials synthesis and characterization, and application.
  • 2D heterostructure characterization and application.
  • Emerging phenomenon in 2D materials and their heterostructures.
  • Property engineering of 2D materials and their related applications.
  • 2D materials nanofabrication approaches.
  • Theoretical calculations of 2D materials properties and related device performance.

Dr. Song Liu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 2D materials
  • heterostructure
  • nanotechnology
  • characterization
  • application
  • nanophotonics
  • nanoelectronics

Published Papers (3 papers)

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Research

15 pages, 8373 KiB  
Article
Manufacturing of Aluminum Nano-Composites Reinforced with Nano-Copper and High Graphene Ratios Using Hot Pressing Technique
by Hossam M. Yehia, Reham A. H. Elmetwally, Abdelhalim M. Elhabak, Omayma A. El-Kady and Ahmed Yehia Shash
Materials 2023, 16(22), 7174; https://doi.org/10.3390/ma16227174 - 15 Nov 2023
Cited by 3 | Viewed by 1567
Abstract
In this study, the nano-aluminum powder was reinforced with a hybrid of copper and graphene nanoplatelets (GNPs). The ratios of GNPs were 0 wt%, 0.4 wt%, 0.6 wt%, 1.2 wt% and 1.8 wt%. To avoid the reaction between aluminum and graphene and, consequently, [...] Read more.
In this study, the nano-aluminum powder was reinforced with a hybrid of copper and graphene nanoplatelets (GNPs). The ratios of GNPs were 0 wt%, 0.4 wt%, 0.6 wt%, 1.2 wt% and 1.8 wt%. To avoid the reaction between aluminum and graphene and, consequently, the formation of aluminum carbide, the GNP was first metalized with 5 wt% Ag and then coated with the predetermined 15 wt% Cu by the electroless coating process. In addition, the coating process was performed to improve the poor wettability between metal and ceramic. The Al/(GNPs-Ag)Cu nanocomposites with a high relative density of 99.9% were successfully prepared by the powder hot-pressing techniques. The effects of (GNPs/Ag) and Cu on the microstructure, density, hardness, and compressive strength of the Al-Cu nanocomposite were studied. As a result of agitating the GNPs during the cleaning and silver and Cu-plating, a homogeneous distribution was achieved. Some layers formed nano-tubes. The Al4C3 phase was not detected due to coating GNPs with Cu. The Cu9Al4 intermetallic was formed during the sintering process. The homogeneous dispersion of Cu and different ratios of GNs, good adhesion, and the formation of the new Cu9Al4 intermetallic improved in hardness. The pure aluminum sample recorded 216.2 HV, whereas Al/Cu reinforced with 1.8 GNs recorded 328.42 HV with a 51.9% increment. The compressive stress of graphene samples was improved upon increasing the GNPs contents. The Al-Cu/1.8 GNs sample recorded 266.99 MPa. Full article
(This article belongs to the Special Issue Advanced 2D Nanomaterials: Characterization and Application)
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16 pages, 2388 KiB  
Article
A Molecular Dynamics Simulation Study of In- and Cross-Plane Thermal Conductivity of Bilayer Graphene
by Rafat Mohammadi, Mohammad Reza Ghaderi and Ebrahim Hajian
Materials 2023, 16(20), 6714; https://doi.org/10.3390/ma16206714 - 16 Oct 2023
Viewed by 1347
Abstract
Efficient thermal management of modern electronics requires the use of thin films with highly anisotropic thermal conductivity. Such films enable the effective dissipation of excess heat along one direction while simultaneously providing thermal insulation along the perpendicular direction. This study employs non-equilibrium molecular [...] Read more.
Efficient thermal management of modern electronics requires the use of thin films with highly anisotropic thermal conductivity. Such films enable the effective dissipation of excess heat along one direction while simultaneously providing thermal insulation along the perpendicular direction. This study employs non-equilibrium molecular dynamics to investigate the thermal conductivity of bilayer graphene (BLG) sheets, examining both in-plane and cross-plane thermal conductivities. The in-plane thermal conductivity of 10 nm × 10 nm BLG with zigzag and armchair edges at room temperature is found to be around 204 W/m·K and 124 W/m·K, respectively. The in-plane thermal conductivity of BLG increases with sheet length. BLG with zigzag edges consistently exhibits 30–40% higher thermal conductivity than BLG with armchair edges. In addition, increasing temperature from 300 K to 600 K decreases the in-plane thermal conductivity of a 10 nm × 10 nm zigzag BLG by about 34%. Similarly, the application of a 12.5% tensile strain induces a 51% reduction in its thermal conductivity compared to the strain-free values. Armchair configurations exhibit similar responses to variations in temperature and strain, but with less sensitivity. Furthermore, the cross-plane thermal conductivity of BLG at 300 K is estimated to be 0.05 W/m·K, significantly lower than the in-plane results. The cross-plane thermal conductance of BLG decreases with increasing temperatures, specifically, at 600 K, its value is almost 16% of that observed at 300 K. Full article
(This article belongs to the Special Issue Advanced 2D Nanomaterials: Characterization and Application)
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14 pages, 2988 KiB  
Article
Induction of Chirality in Atomically Thin ZnSe and CdSe Nanoplatelets: Strengthening of Circular Dichroism via Different Coordination of Cysteine-Based Ligands on an Ultimate Thin Semiconductor Core
by Daria A. Kurtina, Valeria P. Grafova, Irina S. Vasil’eva, Sergey V. Maksimov, Vladimir B. Zaytsev and Roman B. Vasiliev
Materials 2023, 16(3), 1073; https://doi.org/10.3390/ma16031073 - 26 Jan 2023
Cited by 6 | Viewed by 2570
Abstract
Chiral nanostructures exhibiting different absorption of right- and left-handed circularly polarized light are of rapidly growing interest due to their potential applications in various fields. Here, we have studied the induction of chirality in atomically thin (0.6–1.2 nm thick) ZnSe and CdSe nanoplatelets [...] Read more.
Chiral nanostructures exhibiting different absorption of right- and left-handed circularly polarized light are of rapidly growing interest due to their potential applications in various fields. Here, we have studied the induction of chirality in atomically thin (0.6–1.2 nm thick) ZnSe and CdSe nanoplatelets grown by a colloidal method and coated with L-cysteine and N-acetyl-L-cysteine ligands. We conducted an analysis of the optical and chiroptical properties of atomically thin ZnSe and CdSe nanoplatelets, which was supplemented by a detailed analysis of the composition and coordination of ligands. Different signs of circular dichroism were shown for L-cysteine and N-acetyl-L-cysteine ligands, confirmed by different coordination of these ligands on the basal planes of nanoplatelets. A maximum value of the dissymmetry factor of (2–3) × 10−3 was found for N-acetyl-L-cysteine ligand in the case of the thinnest nanoplatelets. Full article
(This article belongs to the Special Issue Advanced 2D Nanomaterials: Characterization and Application)
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