Semiconductor Packaging for the Age of Digitalization: New Materials, Technologies and Processes
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: closed (30 September 2021) | Viewed by 3385
Special Issue Editor
Interests: metallic interconnect development; optoelectronic and sensor packaging; reliability analysis and lifetime prediction; condition monitoring; sensor data fusion and smart sensor systems
Special Issue Information
Dear Colleagues,
We are continuously observing new challenges in microelectronic packaging. Major trends like the Internet of Things, digitalization, and the application of Artificial Intelligence (AI) drive new requirements for hardware: new chip and system architecture, an increasing number of electric interconnects, low power consumption and miniaturization. In addition, autonomous intelligent systems such as self-driving cars will cause new challenges for functional safety, reliability, and lifetime prediction in the field of electronic devices. Cost-efficient methods for condition monitoring needs to be integrated on package level and realized on system level. Replacement, reusability, and recyclability of components and modules will become important for microelectronic packaging to approach the “0-failure vision” for complex systems within a sustainable and ecofriendly solution. Another major trend is the transition of energy supply and electrification, which affects microelectronic packaging. Power electronics, e.g., converters and electromobility, enable, in combination with wide gap semiconductors, high operation temperature under severe environmental conditions which are demanding for electronic materials, e.g., electrical and mechanical interconnect and encapsulation. The upcoming age of digitalization and Artificial Intelligence will be based on the hardware—based on new material, technologies, and packaging processes.
Prof. Dr. Gordon Elger
Guest Editor
Manuscript Submission Information
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Keywords
- electrical and mechanical interconnects
- advanced bonding methods and processes
- wafer and panel level packaging
- heterogeneous integration
- redistribution and encapsulation
- reliability and lifetime prediction
