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Selected Papers from IEEE ICKII 2018
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Selected Papers from IEEE ICKII 2018

A special issue of Materials (ISSN 1996-1944).

Deadline for manuscript submissions: closed (31 December 2018) | Viewed by 16987

Special Issue Editors

Prof. Dr. Teen­-Hang Meen

E-Mail Website
Guest Editor
Department of Electronic Engineering National Formosa University, Yunlin 632, Taiwan
Interests: IOT devices; photovoltaic devices; STEM education
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Wenbing Zhao

E-Mail Website
Guest Editor
Department of Electrical Engineering and Computer Science, Cleveland State University, Cleveland, OH 44115, USA
Interests: human-centered systems; machine learning; data science; distributed computing; blockchain
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The 1st IEEE International Conference on Knowledge Innovation and Invention 2018 (IEEE ICKII 2018) will be held on Jeju Island, South Korea, 23–27 July, 2018, and it will provide a unified communication platform for researchers on the topics of information technology, innovation design, communication science and engineering, industrial design, creative design, applied mathematics, computer science, electrical and electronic engineering, mechanical and automation engineering, green technology and architecture engineering, material science and other related fields. This Special Issue on “Selected papers from IEEE ICKII 2018” is expected to select excellent papers presented at IEEE ICKII 2018 on the topic of materials. Scientists all over the world actively want to discover new advanced materials in electrical and mechanical engineering. In recent years, the applications of advanced materials have been highly developing fields, in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. Therefore, the fields of electrical and mechanical materials have been the subjects of review. The scopes of IEEE ICKII 2018 are not only encompasses material sizes at the nanoscale, but also in various dimensions where the onset of size dependent phenomena usually enables novel applications. This Special Issue covers the following scopes: Fundamental and advanced materials of electrical and mechanical engineering, their synthesis and engineering, their application on optical sensors, magnetic, acoustic, and thermal transduction, their integration with many elements, designing of electrical or mechanical devices, evaluation various performance and exploring their broad applications in industry, environmental control, material analysis, etc.

We invite investigators to contribute original research articles, as well as review articles, to this Special Issue. Potential topics include, but are not limited to:

  • Developments of advanced materials for new electrical and optical properties
  • Nanomaterials for preparation and applications
  • Combinatorial methods of advanced materials for mechanical design and optimization
  • Advanced materials for preparation and applications
  • Subjects related to electronic thin films and coating technology
  • Synthesis engineering of advanced materials
  • Advanced materials in mechatronics applications

Schedule:

Manuscript Due: October 31, 2018
First Round of Reviews: December 31, 2018
Second Round of Reviews: January 31, 2019
Acceptance of Final papers and Publication: March 31, 2019

Prof. Dr. Teen­-Hang Meen
Prof. Dr. Wenbing Zhao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Further information on MDPI's Special Issue polices can be found here.

Published Papers (4 papers)

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Research

12 pages, 64714 KiB  
Article
Two-Stage Plasma-Thermal Nitridation Processes for the Production of Aluminum Nitride Powders from Aluminum Powders
by Mei-Chen Sung, Ya-Fen Wang, Shang-Che Chen and Cheng-Hsien Tsai
Materials 2019, 12(3), 359; https://doi.org/10.3390/ma12030359 - 24 Jan 2019
Cited by 6 | Viewed by 3767
Abstract
The synthesis of aluminum nitride (AlN) powders is traditionally done via the thermal nitridation process, in which the reaction temperature reaches as high as 960 °C, with more than several hours of reaction time. Moreover, the occurrence of agglomeration in melting Al particles [...] Read more.
The synthesis of aluminum nitride (AlN) powders is traditionally done via the thermal nitridation process, in which the reaction temperature reaches as high as 960 °C, with more than several hours of reaction time. Moreover, the occurrence of agglomeration in melting Al particles results in poor AlN quality and a low efficiency of nitridation. In this study, an atmosphere-pressure microwave-plasma preceded the pre-synthesis process. This process operates at 550 °C for 2–10 min with the addition of NH4Cl (Al: NH4Cl = 1:1) for generating a hard AlN shell to avoid the flow and aggregation of the melting Al metals. Then, the mass production of AlN powders by the thermal nitridation process can be carried out by rapidly elevating the reaction temperature (heating rate of 15 °C/min) until 1050 °C is reached. X-Ray Diffractometer (XRD) crystal analysis shows that without the peak, Al metals can be observed by synthesizing AlN via plasma nitridation (at 550 °C for 2 min, Al: NH4Cl = 1:1), followed by thermal nitridation (at 950 °C for 1 h). Moreover, SEM images show that well-dispersed AlN powders without agglomeration were produced. Additionally, the particle size of the produced AlN powder (usually < 1 μm) tends to be reduced from 2–5 μm (Al powders), resulting in a more efficient synthesizing process (lower reaction temperature, shorter reaction time) for mass production. Full article
(This article belongs to the Special Issue Selected Papers from IEEE ICKII 2018)
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11 pages, 5075 KiB  
Article
Green Fabrication of Supported Platinum Nanoparticles by Supercritical CO2 Deposition
by Ying-Liang Chen, Cheng-Hsien Tsai, Mei-Yin Chen and Yi-Chieh Lai
Materials 2018, 11(12), 2587; https://doi.org/10.3390/ma11122587 - 18 Dec 2018
Cited by 3 | Viewed by 3668
Abstract
Pt nanoparticles were successfully deposited on uncatalyzed carbon paper by the supercritical CO2 deposition (SCD) method using platinum (II) acetylacetonate as a precursor followed by thermal conversion. A full 24 factorial design (four factors, each with two levels) was used to [...] Read more.
Pt nanoparticles were successfully deposited on uncatalyzed carbon paper by the supercritical CO2 deposition (SCD) method using platinum (II) acetylacetonate as a precursor followed by thermal conversion. A full 24 factorial design (four factors, each with two levels) was used to investigate the main effect of four factors (deposition temperature, deposition time, reduction temperature, and reduction time) and the interaction effects between them. The morphological structures and surface properties of the Pt/carbon paper composite were analyzed by X-ray diffraction (XRD), scanning electron microscope (SEM)/energy-dispersive X-ray spectroscopy analyzer (EDS), and high-resolution transmission electron microscopy (HR-TEM). The results of the 24 factorial design showed that Pt loading on the substrate correlated significantly with deposition time, while Pt aggregation slightly increased with the thermal reduction temperature. Data obtained from both XRD and HR-TEM were in good agreement and showed that Pt nanoparticles were homogeneously dispersed on the substrate with diameters of 7.2–8.7 nm. Full article
(This article belongs to the Special Issue Selected Papers from IEEE ICKII 2018)
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Graphical abstract

13 pages, 4925 KiB  
Article
Effect of Tartaric Acid on the Printable, Rheological and Mechanical Properties of 3D Printing Sulphoaluminate Cement Paste
by Mingxu Chen, Xiangyang Guo, Yan Zheng, Laibo Li, Zhen Yan, Piqi Zhao, Lingchao Lu and Xin Cheng
Materials 2018, 11(12), 2417; https://doi.org/10.3390/ma11122417 - 29 Nov 2018
Cited by 51 | Viewed by 5170
Abstract
Rapid setting and low viscosity of sulphoaluminate cement (SAC) make it difficult to be extruded by 3D printing (3DP) technique. In this study, the effect of tartaric acid (TA) on printability, rheology and mechanical property of 3DP SAC paste is investigated. The experimental [...] Read more.
Rapid setting and low viscosity of sulphoaluminate cement (SAC) make it difficult to be extruded by 3D printing (3DP) technique. In this study, the effect of tartaric acid (TA) on printability, rheology and mechanical property of 3DP SAC paste is investigated. The experimental results indicate that the setting time, hydration evolution and apparent viscosity of SAC paste can be well controlled by adding a proper amount of TA to satisfy the requirements of 3DP. An excellent structure of SAC paste with the ultimate deformation rate less than 10% can be printed without compromising mechanical strength. Full article
(This article belongs to the Special Issue Selected Papers from IEEE ICKII 2018)
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11 pages, 6153 KiB  
Article
Dual-Emission Fluorescent Microspheres for the Detection of Biothiols and Hg2+
by Jiahui Wang, Hao Zhang and Ruifang Guan
Materials 2018, 11(11), 2232; https://doi.org/10.3390/ma11112232 - 9 Nov 2018
Cited by 5 | Viewed by 3400
Abstract
Dual-emission nanosensor for Hg2+ detection was prepared by coupling CA-AEAPMS on the surface of RBS-doped modified silica microspheres. The CA-AEAPMS was synthesized by using N-(β-aminoethyl)-γ-aminopropyl methyldimethoxysilane (AEAPMS) and citric acid as the main raw material. The obtained nanosensor showed characteristic fluorescence [...] Read more.
Dual-emission nanosensor for Hg2+ detection was prepared by coupling CA-AEAPMS on the surface of RBS-doped modified silica microspheres. The CA-AEAPMS was synthesized by using N-(β-aminoethyl)-γ-aminopropyl methyldimethoxysilane (AEAPMS) and citric acid as the main raw material. The obtained nanosensor showed characteristic fluorescence emissions of Rhodamine B (red) and CA-AEAPMS (blue) under a single excitation wavelength (360 nm). Upon binding to Hg2+, only the fluorescence of CA-AEAPMS was quenched, resulting in the ratiometric fluorescence response of the dual-emission silica microspheres. This ratiometric nanosensor exhibited good selectivity to Hg2+ over other metal ions, because of the amide groups on the surface of CA-AEAPMS serving as the Hg2+ recognition sites. The ratio of F450/F580 linearly decreased with the increasing of Hg2+ concentration in the range of 0 to 3 × 10−6 M, and a detection limit was as low as 97 nM was achieved. Then, the addition of three thiol-containing amino acids (Cys, Hcy, GSH) to the quenched fluorescence solution with Hg2+ can restore the fluorescence, and the detection limits of the three biothiols (Cys, Hcy, GSH) are 0.133 μM, 0.086 μM, and 0.123 μM, respectively. Full article
(This article belongs to the Special Issue Selected Papers from IEEE ICKII 2018)
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