Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
5.8
3.1
Journals
Materials
Special Issues
Novel Materials and Processes for Electronic Packaging
materials-logo
Submit to Materials Review for Materials Propose a Special Issue

Journal Menu

► Journal Menu

Journal Browser

► Journal Browser
share announcement

Novel Materials and Processes for Electronic Packaging

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: closed (10 December 2022) | Viewed by 9738

Special Issue Editor

Prof. Dr. Shih-Kang Lin

E-Mail Website
Guest Editor
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan
Interests: electronic interconnection technologies; Li ion batteries; alloy design; ironmaking and steelmaking; computational materials thermodynamics

Special Issue Information

Dear Colleagues,

Driven by new applications ranging from super-computing and fifth/sixth-generation (5G/6G) communications to electric vehicles (EVs) and green energy, advanced high-density electronic packaging technologies, as well as high-power electronic interconnection are in great demand in the electronic industry. Meanwhile, sustainable materials and manufacturing technologies are also needed to meet the low-emission requirements for carbon neutrality. To achieve high-density and high-reliable electronic devices with low energy consumption, innovative materials and processes for electronic packaging play key roles. For high-density packaging, three-dimensional (3D) integration is an emerging technology, while for sustainable processes, low-temperature processes are desired. The 3D structures involve through-silicon-via (TSV), advanced ceramic substrates, and metal-to-metal or metal-to-ceramics bonding, which require various kinds of electronic interconnection technologies, e.g., solder bumping, transient-liquid-phase (TLP) bonding, thermal compression bonding, adhesive bonding, and active metal brazing (ABM). The reliability of heterogeneous interfaces such as warpage and the formation of brittle intermetallic compounds (IMCs) is the major concern for evaluating the materials and processes. 

This Special Issue will cover current challenges, progresses, and outlooks of novel materials and processes for electronic packaging based on advanced simulation and characterizations. Research papers and critical reviews on these fields are both highly welcome.

Prof. Dr. Shih-Kang Lin
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 3D integration
  • heterogeneous integration
  • Cu-to-Cu bonding
  • through-silicon-via (TSV)
  • low-temperature Pb-fee solders
  • transient liquid phase (TLP) bonding
  • thermal compression bonding
  • adhesive bonding
  • active metal brazing
  • metal-ceramics bonding
  • metallic pastes
  • powder sintering
  • warpage
  • electronic packaging and reliability
  • computer simulation for electronic packaging
  • advanced characterizations for electronic packing

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers (3 papers)

Download All Papers
Order results
Result details
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:

Research

Jump to: Review

20 pages, 1967 KiB  
Article
Laser-Assisted Micro-Solder Bumping for Copper and Nickel–Gold Pad Finish
by Sumera Kousar, Karsten Hansen and Thomas Florian Keller
Materials 2022, 15(20), 7349; https://doi.org/10.3390/ma15207349 - 20 Oct 2022
Cited by 5 | Viewed by 3850
Abstract
Flip-chip bonding is a key packaging technology to achieve the smallest form factor possible. Using copper as a direct under-bump metal and performing bonding under little force and at a low temperature eliminates the processing step for the deposition of a suitable wetting [...] Read more.
Flip-chip bonding is a key packaging technology to achieve the smallest form factor possible. Using copper as a direct under-bump metal and performing bonding under little force and at a low temperature eliminates the processing step for the deposition of a suitable wetting metal and offers an economical solution for electronic chip packaging. In this paper, various samples with copper and nickel–gold surface finishes are used to apply an in-house solder bumping, flip-chip bonding and reflow process to exhibit the bump-bond feasibility. Native oxides are reduced using process gases, and copper surface protection and solder wetting are achieved using copper formate. Lead-free 40 µm solder balls were bumped on 80 µm copper pads and 120 µm copper pillars to demonstrate a full intermetallic Cu–Cu bond as a base study for stacking applications. Using a low-force bonding technique, various chips with different dimensions were bonded at 0.5–16 MPa, followed by a reflow step at a maximum temperature of 270 °C. Then, 30 µm solder balls are utilized to bump the samples with NiAu and Cu bond pads at 50 µm pitch. A mean shear strength of 44 MPa was obtained for the 30 µm Cu samples. To the best of our knowledge, 30 µm solder bumping directly on the copper pads by producing copper formate is a novel research contribution. Full article
(This article belongs to the Special Issue Novel Materials and Processes for Electronic Packaging)
►▼ Show Figures

Figure 1

11 pages, 5856 KiB  
Article
Effects of Initial Morphology on Growth Kinetics of Cu6Sn5 at SAC305/Cu Interface during Isothermal Aging
by Jia-Yi Lee and Chih-Ming Chen
Materials 2022, 15(14), 4751; https://doi.org/10.3390/ma15144751 - 7 Jul 2022
Cited by 5 | Viewed by 2127
Abstract
Solder/Cu joints are important components responsible for interconnection in microelectronics. Construction of the solder/Cu joints through liquid/solid (L/S) reactions accompanies the formation of the Cu–Sn intermetallic compounds (IMCs) at the joint interface. The Cu6Sn5 IMC exhibits remarkable distinctions in thickness [...] Read more.
Solder/Cu joints are important components responsible for interconnection in microelectronics. Construction of the solder/Cu joints through liquid/solid (L/S) reactions accompanies the formation of the Cu–Sn intermetallic compounds (IMCs) at the joint interface. The Cu6Sn5 IMC exhibits remarkable distinctions in thickness and morphology upon increasing the L/S reaction time. Effects of the initial characteristics of thickness and morphology on the growth kinetics of Cu6Sn5 during subsequent isothermal aging were investigated. SAC305 solder was reflowed on a Cu electroplated layer at 265 °C for 1 to 60 min to produce the Cu6Sn5 IMC with different thickness and morphology at the SAC305/Cu interface. The as-fabricated SAC305/Cu joint samples were aged at 200 °C for 72 to 360 h to investigate the growth kinetics of Cu6Sn5. The results show that the initial characteristics of thickness and morphology significantly influenced the growth kinetics of Cu6Sn5 during the subsequent solid/solid (S/S) reaction. A prolonged L/S reaction time of 60 min (L/S-60) produced a scallop-type Cu6Sn5 IMC with a larger grain size and a thicker thickness, which reduced the quantity of fast diffusion path (grain boundary) and the magnitude of concentration gradient, thus slowing down the growth rate of Cu6Sn5. According to the growth kinetics analysis, the growth rate constant of Cu6Sn5 could be remarkably reduced to 0.151 µm/h0.5 for the L/S-60 sample, representing a significant reduction of 70 % compared to that of the L/S-1 sample (0.508 µm/h0.5 for L/S reaction time of 1 min). Full article
(This article belongs to the Special Issue Novel Materials and Processes for Electronic Packaging)
►▼ Show Figures

Figure 1

Review

Jump to: Research

20 pages, 9407 KiB  
Review
Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
by Yu-An Shen and John A. Wu
Materials 2022, 15(14), 5086; https://doi.org/10.3390/ma15145086 - 21 Jul 2022
Cited by 12 | Viewed by 3109
Abstract
Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playing an important role [...] Read more.
Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playing an important role in reliability issues due to its anisotropic diffusivity, mechanical properties, and coefficient of thermal expansion. This study reviews the effects of the Sn grain orientation on the EM, TM, and TMF in Sn-rich solder joints. The findings indicate that in spite of the failure modes dominated by the Sn grain orientation, the size and shape of the solder joint, as well as the Sn microstructures, such as the cycling twining boundary (CTB), single crystals, and misorientations of the Sn grain boundary, should be considered in more detail. In addition, we show that two methods, involving a strong magnetic field and seed crystal layers, can control the Sn grain orientations during the solidification of Sn-rich solder joints. Full article
(This article belongs to the Special Issue Novel Materials and Processes for Electronic Packaging)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying articles 1-3
Back to TopTop