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Future Trends in Non-destructive Testing of Materials Using Ultrasound Technology

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Dear Colleagues,

Ultrasonic testing is a representative, non-destructive inspection technique that is safe for use in the human body and is widely used to detect defects in materials or evaluate physical properties. Generally, ultrasonic testing is mainly applied to metal materials, and recently, its application to materials such as polymers and composite materials has been expanded.

However, ultrasonic waves have different propagation properties depending on physical properties such as the speed, density, grain size and orientation of the material, which poses a problem. Accordingly, there is a demand for ultrasonic inspection and evaluation techniques that are suitable for use in various materials.

For the evaluation of material integrity and properties, various ultrasonic non-destructive evaluation techniques such as PAUT, FMC/TFM, non-linear ultrasonic guided waves, and SAM have been proposed. Most ultrasound techniques were developed for use in both in situ and laboratory examinations and play a pivotal role in various industries.

However, new materials are appearing in the industrial field, and technological developments must be made to improve the reliability of ultrasonic techniques.

This Special Issue will cover simulation and experimental studies regarding the latest ultrasound techniques for material evaluation.

Prof. Dr. Ik-Keun Park
Dr. Chungseok Kim
Dr. Wonjae Choi
Guest Editors

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Keywords

non-destructive testing/evaluation (NDT/NDE)
material characterization
ultrasound testing (UT)
phased array ultrasound testing (PAUT)
full matrix capture (FMC)/ total focusing method (TFM)
stress, strain and mechanical property measurements
ultrasonic NDE (imaging and sensing)
scanning acoustic microscopy (SAM)
non-linear ultrasonic applications
terahertz ultrasound applications
guided wave technique
ultrasonic wave modeling
wave propagation and scattering
artificial intelligence and machine learning

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Research

12 pages, 8535 KiB

Open AccessArticle

Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System

by Tae Hyeong Kim, Dongchan Kang, Jeong Nyeon Kim and Ik Keun Park

Materials 2023, 16(2), 860; https://doi.org/10.3390/ma16020860 - 16 Jan 2023

Viewed by 1677

Abstract

In this study, an ultra-high-resolution acoustic microscopy system capable of non-destructively evaluating defects that may occur in thin film structures was fabricated. It is an integrated system of the control module, activation module, and data acquisition system, in which an integrated control software for controlling each module was developed. The control module includes the mechanical, control, and ultrasonic parts. The activation module was composed of the pulser/receiver, and the data acquisition system included an A/D board. In addition, the integrated control software performs system operation and material measurement and includes an analysis program to analyze the obtained A-Scan signals in various ways. A through-silicon via (TSV) device, which is a semiconductor structure, was prepared to verify the performance of the developed system. The TSV device was analyzed using an ultra-high-resolution acoustic microscope. When the C-Scan images were analyzed, void defects with a size of 20 μm were detected at a depth of approximately 32.5 μm. A similar result could be confirmed when the cross section was measured using focused ion beam (FIB) microscopy. Full article

(This article belongs to the Special Issue Future Trends in Non-destructive Testing of Materials Using Ultrasound Technology)

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11 pages, 3271 KiB

Open AccessArticle

Evaluation of Adhesion Properties of Thin Film Structure through Surface Acoustic Wave Dispersion Simulation

by Yu Min Choi, Dongchan Kang, Jeong Nyeon Kim and Ik Keun Park

Materials 2022, 15(16), 5637; https://doi.org/10.3390/ma15165637 - 16 Aug 2022

Cited by 4 | Viewed by 1242

Abstract

A theoretical simulation study of the dispersion characteristic of the surface acoustic wave (Rayleigh wave) was conducted by modeling the adhesion interlayer with stiffness coefficients to evaluate the bonding properties of nano-scale thin film structures. For experimental validation, a set of thin film specimens were fabricated—637 nm, 628 nm, 637 nm, 600 nm, and 600 nm thick titanium (Ti) films were deposited on silicon (Si) (100) substrate using a DC Magnetron sputtering process with DC power from 28.8 W, 57.6 W, 86.4 W, 115.2 W, and 144 W. The thicknesses of the Ti films were measured using a scanning electron microscope (SEM). Surface acoustic wave velocity for each of the manufactured thin film specimens was measured by using a V(z) curve technique of a Scanning Acoustic Microscope. The measured velocity, transducer frequency, and thickness of the film were applied to dispersion characteristic simulation for a given stiffness coefficient to calculate adhesion strength of each specimen. To verify the simulation result, the adhesion force of each specimen was measured using a nano-scratch test and then compared with the calculated values from the dispersion characteristic simulation. The value of adhesion strength from the dispersion characteristic simulation and the value of adhesion force of the nano-scratch test were found to have a similar tendency according to the process variable of the thin film. The results demonstrated that the adhesion strength of a thin film could be evaluated quantitatively by calculating the dispersion characteristics with the adhesion interlayer stiffness model. Full article

(This article belongs to the Special Issue Future Trends in Non-destructive Testing of Materials Using Ultrasound Technology)

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Future Trends in Non-destructive Testing of Materials Using Ultrasound Technology

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