Reliability Aspects of Lead-Free Solder Alloys Used in Electronics
A special issue of Metals (ISSN 2075-4701).
Deadline for manuscript submissions: closed (30 June 2021) | Viewed by 28114
Special Issue Editor
Special Issue Information
Dear Colleagues,
Lead-free solder alloys are used in numerous electronic devices and systems, e.g., for interconnections, wires, surface finishes, packaging, etc. Electronic systems like IoT devices, communications networks, autonomous cars and planes, sensors and actuators are becoming more important in our everyday lives. Consequently, lead-free solder alloys as candidates for the replacement of the traditionally lead-bearing alloys should exhibit excellent mechanical, electrical, thermal, and reliability properties, in addition to having favorable economic aspects. This initiates the continuous development and preparation of new alloys via the use of novel techniques like mechanical-, micro-, and nano-alloying, which belong to a rapidly evolving multidisciplinary research field combining metallurgy, chemistry, and physics.
In many fields, electronic devices need to operate in harsh environments, so not only the quality but the long-term reliability of the applied alloys is also critical. There is a strong need to investigate the temperature- and humidity-induced failure mechanisms in these alloys, such as electrochemical migration, corrosion, intermetallic formation, and microstructural changes, and their effects on alloy properties, which affect the life-time of electronic devices. It is also necessary to examine the possible surface-preservation methods of the applied material systems against the most frequent failure mechanisms (e.g., oxidation, dendrite, and whisker growth).
This Special Issue is dedicated to disseminating the recent topics and the latest results on reliability in electronics. We invite colleagues to contribute to this Special Issue with works addressing the aforementioned topics and following keywords in the form of full papers, short communications, and reviews. The Special Issue focuses on the reliability of the lead-free solder alloys, but other related topics are also welcome!
Dr. Bálint Medgyes
Guest Editor
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Keywords
- lead-free solder alloys
- lead-free surface finishes
- reliability tests
- electrochemical corrosion
- electrochemical migration
- whisker formation
- intermetallic compound
- life-time prediction
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