Feature Reviews in Micromachines 2024

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: 31 December 2024 | Viewed by 1423

Special Issue Editors


E-Mail Website
Guest Editor
1. Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hong Kong, China
2. School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798, Singapore
Interests: NEMS/MEMS; optofluidics; metasurface; nanophotonics
Special Issues, Collections and Topics in MDPI journals

grade E-Mail Website
Guest Editor
Terasaki Institute for Biomedical Innovation, 1018 Westwood Blvd, Los Angeles, CA 90024, USA
Interests: bio-micro-electro-mechanical systems (BioMEMS); biomedical and implantable devices; biosensors; organs-on-a-chip; micro- and nanosensors for monitoring organs-on-a-chip; flexible electronics and sensors for wound healing; packaging and encapsulation of implantable devices; biomaterials; biofabrication
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Many advances have been made in recent years in the fields of micromachines and microtechnology, and we believe that a state-of-the-art review of existing works will be a great reference for students, researchers and lecturers in both research and teaching related to micromachines. This Special Issue aims to collect high-quality review papers that include a brief retrospective overview and a broad state-of-the-art review of the topics within the scope of micromachines.

The reviews will be published as fully open access after peer review to benefit both authors and readers. You are welcome to send short proposals for reviews to our Editorial Office ([email protected]) for evaluation before submission.

Prof. Dr. Ai-Qun Liu
Dr. Mehmet Remzi Dokmeci
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Related Special Issue

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Review

36 pages, 9951 KiB  
Review
Recent Advances in Metal-Oxide-Based Photoresists for EUV Lithography
by Muhammad Waleed Hasan, Laura Deeb, Sergei Kumaniaev, Chenglu Wei and Kaiying Wang
Micromachines 2024, 15(9), 1122; https://doi.org/10.3390/mi15091122 - 31 Aug 2024
Viewed by 1081
Abstract
Extreme ultraviolet lithography (EUVL) is a leading technology in semiconductor manufacturing, enabling the creation of high-resolution patterns essential for advanced microelectronics. This review highlights recent progress in inorganic metal-oxide-based photoresists, with a focus on their applications in EUVL. The unique properties of zinc-based, [...] Read more.
Extreme ultraviolet lithography (EUVL) is a leading technology in semiconductor manufacturing, enabling the creation of high-resolution patterns essential for advanced microelectronics. This review highlights recent progress in inorganic metal-oxide-based photoresists, with a focus on their applications in EUVL. The unique properties of zinc-based, tin–oxygen, and IVB group inorganic photoresists are examined, showcasing their enhanced chemical reactivity and precise patterning capabilities. Key advancements include the development of zinc oxide and tin oxide nanoparticles, which demonstrate significant improvements in photon absorption and solubility under extreme ultraviolet exposure. Additionally, the review delves into the photochemical reactions of tin–oxygen clusters and the influence of various ligands on film density and cross-linking. The findings suggest that these inorganic photoresists not only improve photolithographic performance but also hold potential for broader applications, such as pyroelectric infrared sensors and 3D printing. Future research directions are outlined, including the optimization of process parameters, the exploration of new ligand and metal combinations, and the evaluation of the environmental benefits of inorganic photoresists over traditional organic ones. These advancements are poised to further enhance the resolution and patterning capabilities required for next-generation semiconductor devices. Full article
(This article belongs to the Special Issue Feature Reviews in Micromachines 2024)
Show Figures

Figure 1

Back to TopTop