Recent Advances in Thin-Film Devices
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: closed (15 September 2025) | Viewed by 497
Special Issue Editors
Interests: electronic thin-film device; wide energy gap semiconductor materials; solar cell materials
Interests: nano-structured materials; optoelectronic materials and devices; surface and material analysis techniques and their novel applications
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Thin-film materials are essential for the future of electronics. The thin-film material process is an environmentally benign technology. A thin film is defined as a low-dimensional material, which is a condensed one-by-one atomic/ molecular/ ionic species of matter. The thickness is typically less than several microns. The functional properties of thin films are governed by both chemical composition and microstructure. Thin-film materials are based on micro/nano structures and its devices have various applications. The classes of materials include silicon, carbon, glasses, polymers (plastics), metals, ceramics, composites, liquid crystals, colloids, semiconductors, and superconductors, as well as magnetic, optical, photonic, optoelectronic, and nanoscale materials. The goal of this Special Issue is to provide a platform for scientists and academicians all over the world to promote, share, and discuss various new issues and developments in the area of thin-film materials and their applications. In this Special Issue, we intend to invite authors to submit original research on thin-film materials and their applications. Potential topics include, but are not limited to, the following:
- Thin-film materials and devices;
- Functional properties of thin films on devices;
- Micro/nano-scaled microstructures of thin films;
- Thin-film processes.
Dr. Sean Wu
Dr. Tsung-Shine Ko
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thin-film materials and devices
- functional properties of thin films on devices
- micro/nano-scaled microstructures of thin films
- thin-film processes
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