Micro-Nano Technology in Intelligent Flexible Electronics: Design, Fabrication and Applications
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: closed (31 August 2022) | Viewed by 2944
Special Issue Editors
Interests: intelligent sense; functional and smart composites; micro/nano-device mechanics; soft electronics; intelligent manufacturing
Special Issues, Collections and Topics in MDPI journals
Interests: flexible electronics; electronic skin for health monitoring, pressure sensing, and materials perception; sensors with new mechanisms
Special Issue Information
Dear Colleagues,
Research in flexible electronics has rapidly heated up in recent years, and some of its applications have entered our daily life, especially in the field of health monitoring and robotics. Traditionally, flexible electronics focus on how to implement circuits and electronic devices based on flexible or stretchable materials. For instance, electronic skin (E-skin), a sensory system that mimics the perception function of human skin, usually integrates flexible or stretchable sensor devices with sensing functions such as pressure, strain, temperature, vibration, etc. Micro and nano technologies are applied extensively in the design, fabrication, and application of E-skin devices. As a general example, in flexible pressure sensors for E-skin, researchers have introduced many natural or carefully designed micro- and nanostructures to effectively make the apparent Young's modulus of the active material layer much lower than it is in its solid form, thereby improving sensitivity. Additionally, the hysteresis can be suppressed through proper microstructure design, thus improving the accuracy of the sensor. Today, flexible electronics has reached a new stage where we cannot be satisfied with merely pursuing a single device in terms of performance breakthroughs and the capture or transmission of raw, unprocessed data. The emerging research on AR/VR, human–machine interfaces, bionic prostheses, and humanoid robots puts forward more intelligent demands on flexible electronic devices, and the combination of flexible electronics and artificial intelligence (AI) technology will become a new research trend. For instance, wireless wearable flexible devices with AI technology that can be used to intelligently monitor the symptoms of COVID-19 have been reported. Correspondingly, the application of micro/nano technology in such intelligent flexible electronics has also been further developed. Here, this Special Issue seeks to showcase research papers and review articles that focus on the topic of Micro/Nano Technology in Intelligent Flexible Electronics: Design, Fabrication, and Application.
We look forward to receiving your submissions!
Dr. Weidong Yang
Dr. Wen Cheng
Dr. Haibo Li
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- intelligent sense
- flexible electronics
- functional and smart materials
- nanocomposites
- structure design
- sensors
- electronic skin
- micro/nano-fabrication
- 3D/4D printing
- surface/interface
- microstructure
- electromechanical coupling property
- buckling and postbuckling
- flexible chip and packaging
- healthcare monitoring
