NEMS and MEMS Packaging and Reliability
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (30 November 2015) | Viewed by 6887
Special Issue Editor
Interests: terahertz quantum tunneling metal-insulator-metal (MIM) diodes for quantum electronics; memristors; opto-nano- and micro-electro-mechanical systems (O-N/MEMS); photo-electro-chemical systems; nano-biosensors
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Special Issue Information
Dear Colleagues,
Global trends in the field of NEMS and MEMS (nano and micro-electromechanical systems) are driving research for the rapid miniaturization of low-power, high-bandwidth, and high density devices for health technologies, wireless communication, and smart sensor systems, and for applications to detect and manipulate anomalies, such as pathogens, tumors, etc.
The Emerging Technologies Program of the National Science Foundation (NSF) and Defense Advanced Research Projects Agency (DARPA) selected NEMS and MEMS as a research focal point and, consequently, their funding increased dramatically. Similar investments have also been made in Europe and Asia, causing the manufacturing of NEMS and MEMS devices to become a substantial part of the high-tech manufacturing technologies. However, there are currently unsolved problems in N/MEMS device design and manufacturing.
As devices become increasingly smaller, more challenges are faced in manufacturing, packaging, and testing. For example, researchers must determine how to robustly join these miniature building blocks while avoiding excessive damage.
Moreover, fabrication of nano- and micro-electro-mechanical systems (NEMS and MEMS) devices with low contact resistance still remains as one of the serious challenges in nano and micro device engineering. In addition, there are substantial barriers in integrating/ packaging the NEMS and MEMS chips into conventional CMOS systems.
Prof. Dr. Mustafa Yavuz
Guest Editor
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Keywords
- NEMS
- MEMS
- manufacturing
- integration
- packaging
- testing and reliability
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