Synthesis and Application of Epoxy-Based Polymeric Materials
A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".
Deadline for manuscript submissions: 31 July 2025 | Viewed by 1170
Special Issue Editor
Special Issue Information
Dear Colleagues,
Epoxy-based polymeric materials are utilized extensively in various fields such as aerospace, automotives, energy, and electronics, as well as in building materials, due to their exceptional mechanical and electrical insulation, bonding capabilities, and chemical resistance. Currently, there is growing interest in developing high-performance epoxy polymers and composites that are environmentally sustainable; however, challenges remain, including the low toughness of conventional epoxy resins. We lack a systematic understanding of the properties of cross-linked networks, which limits our low-cost approaches to producing resins and their composites and leads to the inferior performance of new environmentally friendly epoxy resins compared to traditional ones, as well as degradation issues and recovery concerns. Therefore, it is crucial to explore innovative technologies for developing advanced epoxy-based polymeric materials that meet the requirements of these fields.
This Special Issue will publish studies related to epoxy-based polymeric materials that focus on the following areas:
(1) Investigations into the structural design, synthesis, molecular characterization, polymerization mechanisms, and properties of epoxy resins.
(2) Composite materials as advanced hardeners, modifiers, and accelerators of high-performance resin matrices.
(3) The synthesis, characterization, processing, and application of epoxy resin adhesives and coatings.
(4) The curing kinetics and mechanisms of different epoxy resin/curing agent systems, analyzed by combining molecular simulation and chemical calculation methods.
(5) Research on the properties and applications of green, recyclable, self-healing epoxy resin materials.
This Special Issue also recommends that authors investigate the fundamental molecular mechanisms of newly developed epoxy resin materials based on their properties to provide researchers with molecular design principles.
Dr. Jihuai Tan
Guest Editor
Manuscript Submission Information
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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- epoxy
- toughening agent
- composite material
- adhesive
- coating
- molecular simulation
- curing kinetics
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