Search Results (9)

The ending of Moore’s Law calls for innovations in integrated circuit (IC) technologies and chip designs. Heterogeneous integration (HI) emerges as a pathway towards smart future chips for more Moore time and for beyond-Moore time, featuring systems-on-integrated-chiplets (SoICs) and advanced micro-packaging (μ-packaging). Reliability, particularly with regard to electrostatic charge (ESD) failure, is a major challenge for 3D SoIC chips in μ-packaging, which is an emerging design-for-reliability challenge for future chips. This perspective article articulates that interposer-based ESD protection will be an important potential solution for 3D SoIC chips in μ-packaging against the devastating ESD failure problem. Full article

Electrostatic discharge (ESD) failure is a major reliability problem for all forms of microelectronics products. ESD protection is required for all integrated circuits (ICs). As dimension scaling-down approaches its physical limit, heterogeneous integration (HI) emerges as a main pathway towards the age beyond Moore’s Law to facilitate advanced microsystem chips with extreme performance and rich functionalities. Advanced packaging is a key requirement for HI-enabled integrated systems-on-chiplets (SoIC) that require robust ESD protection solutions. This article outlines key emerging technical challenges associated with smart future SoIC microsystem superchips in the context of advanced packaging technologies. Full article

The efficient testing and validation of the high-voltage (HV) insulation of small-outline integrated circuit (SOIC) packages presents numerous challenges when trying to achieve faster and more accurate processes. The complex behavior these packages when submerged in diverse physical media with varying densities requires a detailed analysis to understand the factors influencing their behavior. We propose a systematic and scalable mathematical model based on trapezoidal motion patterns and a deterministic analysis of hydrodynamic forces to predict SOIC package misalignment during automated high-voltage testing in a dielectric fluid. Our model incorporates factors known to cause misalignment during the maneuvering of packages, such as surface tension forces, sloshing, cavity formation, surface waves, and bubbles during the insertion, extraction, and displacement of devices while optimizing test speed for minimum testing time. Our model was validated via a full-factorial statistical experiment for different SOIC package sizes on a pick-and-place (PNP) machine with preprogrammed software and a zero-insertion force socket immersed in different dielectric fluids under controlled thermal conditions. Results indicate the model achieves 99.64% reliability with a margin of error of less than 4.78%. Our research deepens the knowledge and understanding of the physical and hydrodynamic factors that impact the automated testing processes of high-voltage insulator SOIC packages of different sizes for different dielectric fluids. It enables improved testing times and higher reliability than traditional trial-and-error methods for high-voltage SOIC packages, leading to more efficient and accurate processes in the electronics industry. Full article

Background and objectives: More and more children with severe-to-profound hearing loss are receiving cochlear implants (CIs) at an early age to improve their hearing and listening abilities, speech recognition, speech intelligibility, and other aspects of spoken language development. Despite this, the rehabilitation outcomes can be very heterogeneous in this population, not only because of issues related to surgery and fitting or the specific characteristics of the child with his/her additional disabilities but also because of huge differences in the quality of the support and rehabilitation offered by the therapist and the family. These quality standards for the rehabilitation of young deaf children receiving CIs are developed within the European KA202 Erasmus+ project “VOICE”—vocational education and training for speech and language therapists and parents for the rehabilitation of children with CIs, Ref. No.: 2020-1-RO01-KA202-080059. Material and methods: To develop these quality standards, we used the input from the face-to-face interviews of 11 local rehabilitation experts in CIs from the four partner countries of the project and the outcomes of the bibliographic analysis of 848 publications retrieved from six databases: Pub Med, Psych Info, CINAHL, Scopus, Eric, and Cochrane. Based on all this information, we created a first set of 32 quality standards over four domains: general, fitting, rehabilitation, and for professionals. Further on, the Delphi method was used by 18 international rehabilitation experts to discuss and agree on these standards. Results: The results from the literature analysis and the interviews show us that more than 90% of the consulted international experts agreed on 29 quality standards. They focus on different aspects of rehabilitation: the multidisciplinary team, their expertise and knowledge, important rehabilitation topics to focus on, and programming issues related to rehabilitation. Conclusions: These quality standards aim to optimize the activity of speech rehabilitation specialists so that they reach the optimal level of expertise. Also presented is the necessary equipment for the IC team to carry out the rehabilitation sessions in good conditions. This set of quality standards can be useful to ensure the appropriate postoperative care of these children. As a result, the rehabilitation process will be more relaxed, and therapists will have the opportunity to focus more on the specific needs of each child, with the provision of quality services, which will result in better results. This theme is particularly complex and dependent on multifactorial aspects of medicine, education, speech therapy, social work, and psychology that are very intricate and interdependent. Full article

The COVID-19 pandemic exposed the vulnerability of global supply chains of many products. One area that requires improved supply chain resilience and that is of particular importance to electronic designers is the shortage of basic dual in-line package (DIP) electronic components commonly used for prototyping. This anecdotal observation was investigated as a case study of using additive manufacturing to enforce contact between premade, off-the-shelf conductors to allow for electrical continuity between two arbitrary points by examining data relating to the stock quantity of electronic components, extracted from Digi-Key Electronics. This study applies this concept using an open hardware approach for the design, testing, and use of a simple, parametric, 3-D printable invention that allows for small outline integrated circuit (SOIC) components to be used in DIP package circuits (i.e., breadboards, protoboards, etc.). The additive manufacture breakout board (AMBB) design was developed using two different open-source modelers, OpenSCAD and FreeCAD, to provide reliable and consistent electrical contact between the component and the rest of the circuit and was demonstrated with reusable 8-SOIC to DIP breakout adapters. The three-part design was optimized for manufacturing with RepRap-class fused filament 3-D printers, making the AMBB a prime candidate for use in distributed manufacturing models. The AMBB offers increased flexibility during circuit prototyping by allowing arbitrary connections between the component and prototyping interface as well as superior organization through the ability to color-code different component types. The cost of the AMBB is CAD $0.066/unit, which is a 94% saving compared to conventional PCB-based breakout boards. Use of the AMBB device can provide electronics designers with an increased selection of components for through-hole use by more than a factor of seven. Future development of AMBB devices to allow for low-cost conversion between arbitrary package types provides a path towards more accessible and inclusive electronics design as well as faster prototyping and technical innovation. Full article

In the last decades, several multidimensional models for measuring and evaluating the innovation capacity and performance of organisations have been designed by researchers and consulting firms and adopted by established innovative organisations worldwide. However, the topic of measurement and evaluation models that are designed for sustainability-oriented innovation management has remained underexplored by researchers and practitioners. From this perspective, this work proposes a conceptual model for measuring and evaluating the sustainability-oriented innovation capacity (SOIC) and performance (SOIP) of established organisations, guided by the following principles: a multidimensional structure, stakeholder goal orientation, interdependence and feedback loop analyses, innovation process orientation and ease of implementation and use. In line with these principles, the proposed model combines the balanced scorecard (BSC) framework with a hybrid multicriteria methodological approach. Furthermore, it considers the interdependencies between the key innovation indicators (KIIs), which are classified according to four perspectives of an adapted BSC framework. The proposed conceptual model, and the empirical results that demonstrate its applicability in an organisational context, may contribute to improving the current practices for measuring and evaluating the SOIC and SOIP, which could help organisations to adjust their strategies to create sustainable value for the new era of business. Full article

Current sources play an essential role in tissue excitation used in bioelectrical impedance spectroscopy. Most investigations use Howland current sources that, despite their practicality and simplified implementation, have operating frequency limitations and dependence on the load impedance due to their narrow output impedance, especially at higher frequencies. The objective of this work is to propose a model for a robust current-controlled sinusoidal oscillator. The oscillator is based on fully analog electronics, which enables controlling the oscillation phase and amplitude by using a voltage reference. The mathematical model is based on Pyragas control application to the classical harmonic oscillator. From the modeling process, an oscillator topology was built based on second-generation current carriers and on transconductance amplifiers. A sinusoidal voltage source having a frequency of 1 MHz and an amplitude of $1V_{pp}$ was used as a reference signal to drive the oscillator. The oscillator output current synchronized the oscillations’ phase and amplitude using the reference, regardless of their magnitude before the control signal acted in the circuit at $t\approx 13.5\mathsf{\mu }$s. SPICE simulations using ideal components have confirmed the successful operation of the proposed oscillator. This type of oscillator can be implemented in SOIC, then allowing oscillation control interface with logic circuits. Full article

Conventional image entropy merely involves the overall pixel intensity statistics which cannot respond to intensity patterns over spatial domain. However, spatial distribution of pixel intensity is definitely crucial to any biological or computer vision system, and that is why gestalt grouping rules involve using features of both aspects. Recently, the increasing integration of knowledge from gestalt research into visualization-related techniques has fundamentally altered both fields, offering not only new research questions, but also new ways of solving existing issues. This paper presents a Bayesian edge detector called GestEdge, which is effective in detecting gestalt edges, especially useful for forming object boundaries as perceived by human eyes. GestEdge is characterized by employing a directivity-aware sampling window or mask that iteratively deforms to probe or explore the existence of principal direction of sampling pixels; when convergence is reached, the window covers pixels best representing the directivity in compliance with the similarity and proximity laws in gestalt theory. During the iterative process based on the unsupervised Expectation-Minimization (EM) algorithm, the shape of the sampling window is optimally adjusted. Such a deformable window allows us to exploit the similarity and proximity among the sampled pixels. Comparisons between GestEdge and other edge detectors are shown to justify the effectiveness of GestEdge in extracting the gestalt edges. Full article

Recently, an upsurge of deep learning has provided a new direction for the field of computer vision and visual tracking. However, expensive offline training time and the large number of images required by deep learning have greatly hindered progress. This paper aims to further improve the computational performance of CNT which is reported to deliver 5 fps performance in visual tracking, we propose a method called Fast-CNT which differs from CNT in three aspects: firstly, an adaptive k value (rather than a constant 100) is determined for an input video; secondly, background filters used in CNT are omitted in this work to save computation time without affecting performance; thirdly, SURF feature points are used in conjunction with the particle filter to address the drift problem in CNT. Extensive experimental results on land and undersea video sequences show that Fast-CNT outperforms CNT by 2~10 times in terms of computational efficiency. Full article