Search Results (244)

Here, the resistive switching characteristics in a Cu/a-SiC/P+-Si sandwiched structure are systematically investigated for multilevel nonvolatile memory applications. The formation of Cu conducting filaments is believed to be the switching mechanism through temperature-dependent testing. Four distinguished resistance states can be achieved in the Cu/a-SiC/P+-Si memory device through the modulation of suitable compliance current, which could be attributed to the formation of more conductive filaments when applying a higher compliance current during the Set process. In addition, these different resistance values can be easily distinguished and show reliable retention (~105 s), with the temperature even reaching 85 °C, which offers considerable potential for high-density RRAM applications. Full article

Memristors are valuable elements with very good memory and switching features. They have minimal power consumption, nano-scale sizes, and a possibility for integration with high-density Complementary Metal Oxide Semiconductor (CMOS) integrated circuits. They are applicable in neural networks, memory crossbars, and different electronic devices. This work considers some improved and existing models for memristors, functioning at high-frequency signals with a high speed and very good effectiveness. The main parasitic parameters—series resistance, capacitance, and small-signal direct current (DC) voltage and current shifting signals—are taken into account. An additional leakage conductance is analyzed as a parasitic component. The influence of the parasitic parameters on the normal functioning of memristor-based circuits is analyzed and evaluated at hard-switching and soft-switching modes. For investigations of the main characteristics of the considered models and their applicability in memory arrays, Linear Technology Simulation Program with Integrated Circuits Emphasis (LTSPICE) library models are generated and analyzed. The considered models operate at low-, middle- and high-frequency signals, clearly demonstrating the main properties of memristors. Their appropriate operation in passive memory arrays is analyzed and established. The proposed models have a 26% enhanced accuracy in fitting experimental i-v relations. They ensure good memory and switching properties for memory arrays. This work could be a suitable step towards the design and manufacturing of ultra-high-density memristor-based integrated chips. Full article

In the post-Moore’s Law era, conventional Von Neumann architectures face critical limitations, such as the “memory wall” and excessive power consumption, particularly when processing unstructured data. Neuromorphic computing, inspired by the human brain, offers a promising solution through parallel processing and adaptive learning. Among the candidates for artificial synapses, memristors based on two-dimensional MXenes (specifically Ti₃C₂T_x) have attracted significant attention due to their unique layered structure, high metallic conductivity, and tunable physicochemical properties. This review provides a comprehensive analysis of MXene-based memristors, from material synthesis to system-level applications. We examine how different synthesis strategies, including etching methods, directly influence device performance and elucidate the underlying resistive switching mechanisms driven by ion migration, valence change, and interfacial processes. Furthermore, the review demonstrates the efficacy of MXenes in emulating biological synaptic functions—such as spike-timing-dependent plasticity (STDP) and long-term potentiation/depression (LTP/LTD)—and their application in tasks like handwritten digit recognition. Finally, we highlight emerging frontiers in flexible electronics and in-sensor computing, offering insights into the future trajectory of integrated sensing, memory, and computation. Full article

Ba_0.6Sr_0.4TiO₃ (BST) thin films were deposited on ITO substrates via rf magnetron sputtering, followed by structural and morphological characterization using XRD and FE-SEM. Metal–insulator–metal (MIM) RRAM devices were fabricated by depositing Al top electrodes, and their electrical properties were examined through I–V measurements. The optimized BST films deposited at 40% oxygen concentration exhibited stable resistive switching, with an operating voltage of 3 V, an on/off ratio of 1, and a leakage current of 10⁻⁸ A. After rapid thermal annealing at 500 °C, the on/off ratio improved to 2 but leakage increased to 10⁻³ A. Incorporating an electron transport layer (ETL) effectively suppressed the leakage current to 10⁻⁵ A while maintaining the on/off ratio at 2. Moreover, a transition from bipolar to unipolar switching was observed at higher oxygen concentration (60%). These results highlight the role of ETLs in reducing leakage and stabilizing switching characteristics, providing guidance for the development of transparent, low-power, and high-reliability BST-based RRAM devices. This study aims to investigate the role of Ba_0.6Sr_0.4TiO₃ (BST) ferroelectric oxide as a functional switching layer in resistive random-access memory (RRAM) and to evaluate how interface engineering using an electron transport layer (ETL) can improve resistive switching stability, leakage suppression, and device reliability. Full article

Work investigates the doping of molybdenum oxide (MoO_x) with tungsten (W). The successful incorporation of W into the MoO_x lattice was confirmed through X-ray photoelectron spectroscopy (XPS) and energy-dispersive X-ray spectroscopy (EDS). Structural and optical analysis revealed the presence of oxygen vacancies within the W-MoO_x film, which are known to facilitate resistive switching (RS) in memristive devices. Based on this, a flexible memristor with the structure PET/ITO/W-MoO_x/polymethyl methacrylate (PMMA)/Al was fabricated. PMMA was strategically introduced between the W-MoO_x layer and the aluminum electrode to modulate interfacial properties that influence RS behavior. The W-MoO_x/PMMA-based memristor exhibited good resistive switching characteristics, with a memory window of approximately 12 and a retention time exceeding 2 × 10⁴ s, demonstrating a non-volatile memory behavior. In the high-resistance state (HRS), the conduction mechanism under higher applied voltages follows a space-charge-limited current (SCLC) model, indicating that the RS process is primarily governed by charge trapping and de-trapping at the interface. Overall, the consistent and robust switching performance of the W-MoO_x/PMMA heterostructure underlines its potential as a reliable functional layer for next-generation resistive random-access memory (ReRAM) devices. Full article

In the pursuit of advanced non-volatile memory technologies, ferroelectric memristors have attracted great attention. However, traditional perovskite ferroelectric materials are hampered by environmental pollution, limited applicability, and the complexity and high cost of conventional vacuum deposition methods. This has spurred the exploration of alternative materials and fabrication strategies. Herein, a flexible Pt/Zr: HfO₂ (HZO)/graphene oxide (GO)/mica memristor is successfully fabricated using the total solution-processed method. The interfacial oxygen competition mechanism between the HZO layer and the GO bottom electrode facilitates the formation of the HZO ferroelectric phase. The as-prepared device exhibits a switching ratio of approximately 150 and can maintain eight distinct resistance levels, and it can also effectively simulate neural responses. By integrating the ferroelectric polarization principle and the piezoelectric effect of HZO, along with the influence of GO, the performance variations of the as-prepared device under mechanical and thermal influences are further explored. Notably, Morse code recognition is achieved by utilizing the device’s pressure properties and setting specific press rules. The as-prepared device can accurately convert and store information, opening new avenues for non-volatile memory applications in silent communication and promoting the development of wearable electronics. Full article

The random thermal switching of domain walls (DWs) in perpendicularly magnetized anisotropy nanowires (PMA) poses a significant challenge for the reliability of spintronic storage devices. In this work, we study the thermal nucleation and dynamics of DWs in PMA nanowires using micromagnetic simulations. The focus is on the effect of device temperature, with attention to uniaxial anisotropy energy (K_u), saturation magnetization (M_s), and nanowire geometry. The results show that larger K_u or M_s reduces DW thermal switching, thereby enhancing DW thermal stability and increasing the DW nucleation temperature (T_n). A wider or thicker nanowire also lowers the probability of thermally induced DW creation, further improving stability. In addition, DW velocity rises with temperature, showing a thermally assisted motion. These results provide useful guidance for designing PMA-based memory devices with improved resistance to thermal fluctuations. Full article

In this study, silicon carbide (SiC) thin films for resistive random-access memory (RRAM) devices were successfully prepared using the radio-frequency magnetron sputtering method at deposition powers of 50 and 75 W for 1 h. The aluminum (Al) top electrode of the RRAM devices was also fabricated using thermal evaporator deposition. Additionally, the electrical properties of the SiC thin film RRAM devices were determined using a B2902A mechanism. The current–voltage (I–V) curves of the as-deposited SiC thin films at 50 and 75 W power levels were measured and analyzed. Specifically, the set and reset voltages for the RRAM devices deposited at 50 and 75 W were approximately 1.2 and −1.5 V, respectively. For the annealed samples, the memory windows of the 75 W SiC thin film RRAM devices treated at 300 °C were found to be around 10⁵. Full article

Gallium oxide (Ga₂O₃)-based memristors are gaining traction as promising candidates for next-generation electronic devices toward in-memory computing, leveraging the unique properties of Ga₂O₃, such as its wide bandgap, high thermodynamic stability, and chemical stability. This review explores the evolution of memristor theory for Ga₂O₃-based materials, emphasising capacitive memristors and their ability to integrate resistive and capacitive switching mechanisms for multifunctional performance. We discussed the state-of-the-art fabrication methods, material engineering strategies, and the current challenges of Ga₂O₃-based memristors. The review also highlights the applications of these memristors in memory technologies, neuromorphic computing, and sensors, showcasing their potential to revolutionise emerging electronics. Special focus has been placed on the use of Ga₂O₃ in capacitive memristors, where their properties enable improved switching speed, endurance, and stability. In this paper we provide a comprehensive overview of the advancements in Ga₂O₃-based memristors and outline pathways for future research in this rapidly evolving field. Full article

Resistive switching (RS) phenomena are nowadays one of the most studied topics in the area of microelectronics. It can be observed in Metal–Insulator–Metal (MIM) structures that are the basis of resistive switching random-access memories (RRAMs). In the case of commercial use of RRAMs, it is beneficial that the applied materials would have to be compatible with Complementary Metal-Oxide-Semiconductor (CMOS) technology. Fabricating methods of these materials can determine their stoichiometry and structural composition, which can have a detrimental impact on the electrical performance of manufactured devices. In this study, we present the influence of the Ar/N₂ ratio during reactive magnetron sputtering of titanium nitride (TiN) electrodes on the resistive switching behavior of MIM devices. We used silicon oxide (SiOx) as a dielectric layer, which was characterized by the same properties in all fabricated MIM structures. The composition of TiN thin layers was controlled by tuning the Ar/N₂ ratio during the deposition process. The fabricated conductive materials were characterized in terms of chemical and structural properties employing X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD) analysis. Structural characterization revealed that increasing the Ar content during the reactive sputtering process affects the crystallite size of the deposited TiN layer. The resulting crystallite sizes ranged from 8 Å to 757.4 Å. The I-V measurements of fabricated devices revealed that tuning the Ar/N₂ ratio during the deposition of TiN electrodes affects the RS behavior. Our work shows the importance of controlling the stoichiometry and structural parameters of electrodes on resistive switching phenomena. Full article

Litz wires are extensively employed in contemporary high-frequency switching power electronics to mitigate conductor losses. Minimizing additional winding losses caused by high-frequency phenomena, such as skin and proximity effects, is a critical design consideration for achieving high power density in modern power electronics. However, accurately predicting losses in structures composed of numerous twisted and insulated strands remains a challenge. With the increasing accessibility of commercial numerical tools, such as finite element method (FEM) solvers, simulation-based approaches have become indispensable tools for analyzing electromagnetic phenomena in complex magnetic device structures under high-frequency conditions. In parallel, data-driven modeling has emerged as a powerful method, enabling pattern identification based on datasets; however, such approaches rely on the availability of large amounts of reliable high-quality data. Generating such large-scale FEM datasets, however, is often constrained by long computation times and high memory consumption. Despite the remarkable advancements in computing power, full three-dimensional (3D) FEM analysis at the strand level for Litz wire windings often remains infeasible within personal computing environments. To address these challenges, this study presents a computationally efficient two-dimensional FEM-based framework that integrates a data-driven fitting model with optimized geometric discretization and meshing strategies, enabling accurate analysis with reduced computational load. The proposed approach, which incorporates optimal meshing conditions into commercially available 2D FEM tools and a simple data-driven fitting model, enables accurate prediction of the frequency-dependent AC resistance of multi-turn Litz windings using a typical personal computer. Its feasibility is further demonstrated through experimental frequency response measurements on both 12-turn and 21-turn windings fabricated with 150-strand Litz wire, which show strong agreement with the corrected simulation results, confirming the model’s accuracy and practical applicability. Full article

In this study, tin oxide (SnO₂) resistive random-access memory (RRAM) thin films were fabricated using the thermal evaporation and radiofrequency and dc frequency sputtering techniques for metal–insulator–metal (MIM) structures. The fabrication process began with the deposition of a silicon dioxide (SiO₂) layer onto a silicon (Si) substrate, followed by the deposition of a titanium nitride (TiN) layer to serve as the bottom electrode. Subsequently, the tin oxide (SnO₂) layer was deposited as the resistive switching insulator. Two types of top electrodes were developed to investigate the influence of different oxygen concentrations on the bipolar switching, electrical characteristics, and performance of memory devices. An aluminum (Al) top electrode was deposited using thermal evaporation, while a platinum (Pt) top electrode was deposited via dc sputtering. As a result, two distinct metal–insulator–metal (MIM) memory RRAM device structures were formed, i.e., Al/SnO₂/TiN/SiO₂/Si and Pt/SnO₂/TiN/SiO₂/Si. In addition, the symmetry bipolar switching characteristics, electrical conduction mechanism, and oxygen concentration factor of the tin oxide-based memory devices using rapid thermal annealing and different top electrodes were determined and investigated by ohmic, space-charge-limit-current, Schottky, and Poole–Frenkel conduction equations in this study. Full article

Understanding the resistive switching (RS) mechanisms in memristive devices is crucial for developing non-volatile memory technologies. Here, we investigate the memristor effect in hydrothermally grown Au-nanoseeded CuO films. Based on I-V measurements, conductive-AFM, S/TEM, and EDS analyses, we examine the changes within the switching layer associated with RS. Our results reveal a filamentary mechanism of RS. Notably, EDS mapping shows directional Au redistribution between the bottom nanoseeds and the top electrode, while Cu and O remain uniformly distributed. These findings support an electrochemical metallization (ECM)-like filamentary mechanism driven by Au species migration. The use of Au-nanoseeds, required by the solution-based growth method, critically affects filament formation and RS behavior. Our results emphasize the importance of microstructure and electrode–oxide interfaces in determining the switching mechanism in oxide-based memristors. Full article

Integrating two-dimensional transition-metal dichalcogenides with graphene is attractive for low-power memory and neuromorphic hardware, yet sequential wet transfer leaves polymer residues and high contact resistance. We demonstrate a complementary metal–oxide–semiconductor (CMOS)-compatible, transfer-free route in which an atomically thin amorphous MoS₂ precursor is RF-sputtered directly onto chemical vapor-deposited few-layer graphene and crystallized by confined-space sulfurization at 800 °C. Grazing-incidence X-ray reflectivity, Raman spectroscopy, and X-ray photoelectron spectroscopy confirm the formation of residue-free, three-to-four-layer 2H-MoS₂ (roughness: 0.8–0.9 nm) over 1.5 cm × 2 cm coupons. Lateral MoS₂/graphene devices exhibit reproducible non-volatile resistive switching with a set transition (SET) near +6 V and an analogue ON/OFF ≈2.1, attributable to vacancy-induced Schottky-barrier modulation. The single-furnace magnetron sputtering + sulfurization sequence avoids toxic H₂S, polymer transfer steps, and high-resistance contacts, offering a cost-effective pathway toward wafer-scale 2D memristors compatible with back-end CMOS temperatures. Full article

Two-dimensional (2D) material-based resistive random-access memory (RRAM) has emerged as a promising solution for neuromorphic computing and computing-in-memory architectures. Compared to conventional metal-oxide-based RRAM, the novel 2D material-based RRAM devices demonstrate lower power consumption, higher integration density, and reduced performance variability, benefiting from their atomic-scale thickness and ultra-flat surfaces. Remarkably, 2D layered metal oxides retain these advantages while preserving the merits of traditional metal oxides, including their low cost and high environmental stability. Through a multi-step dry transfer process, we fabricated a Pd-MoO₃-Ag RRAM device featuring 2D α-MoO₃ as the resistive switching layer, with Pd and Ag serving as inert and active electrodes, respectively. Resistive switching tests revealed an excellent operational stability, low write voltage (~0.5 V), high switching ratio (>10⁶), and multi-bit storage capability (≥3 bits). Nevertheless, the device exhibited a limited retention time (~2000 s). To overcome this limitation, we developed a Gr-MoO₃-Ag heterostructure by substituting the Pd electrode with graphene (Gr). This modification achieved a fivefold improvement in the retention time (>10⁴ s). These findings demonstrate that by controlling the type and thickness of 2D materials and resistive switching layers, RRAM devices with both high On/Off ratios and long-term data retention may be developed. Full article