Search Results (34)

Gallium-based liquid metal is corrosive to steel alloys, forming FeGa₃ surface films which can potentially be applied as a solid lubricant to enhance wear resistance and mitigate liquid metal-induced corrosion. However, the characteristics of these films remain insufficiently explored. In this study, Ga-In-Sn alloy was ultrasonically soldered onto annealed and decarburised substrates, followed by heating in a vacuum chamber to form a 30 μm thick FeGa₃ reaction layer. The film on the annealed samples with an alpha-ferrite microstructure exhibited high porosity and a surface roughness of 1.97 Ra. In contrast, the film on the decarburised samples with a ferritic microstructure showed minimal porosity and a lower surface roughness of 1.29 Ra. Nanoindentation tests revealed Young modulus values of 231 GPa and 242 GPa and hardness values of 11.4 GPa and 12.7 GPa for the annealed and decarburised samples, respectively. The high porosity in the annealed samples is attributed to the suppression of FeGa₃ formation in regions containing chromium carbides. Shear stress for fracture, measured by microcantilever tests at the interface between the substrate and the inner matrix of the surface film, showed lower fracture shear stress in the annealed sample, attributed to the presence of larger pores within its microstructure. Full article

Addressing the issue of lifespan prediction for electronic packages under thermal loading, this paper proposes a method for predicting the lifespan of electronic packages based on ultrasonic microimaging. Firstly, experimental samples equipped with flip-chip packages were designed and fabricated and subjected to aging through thermal cycle acceleration tests. Ultrasonic microscopy was utilized to periodically acquire ultrasonic image data for monitoring solder joint degradation. Secondly, the internal ultrasonic wave propagation mechanism within electronic packages was investigated, establishing a qualitative relationship between the intensity in the central region of the solder joint’s ultrasonic image and internal defects within the joint. Image processing techniques were applied to enhance the quality of the solder joint images, and the mean intensity in the central region of the solder joint image was extracted as a failure feature. Finally, based on the extracted failure feature, a data-driven failure model for solder joints was developed, which predicts the lifespan of the solder joints based on cumulative failure probability. The research results indicate that the proposed model accurately describes the failure process of solder joints and effectively differentiates the lifespan variations among solder joints at different locations on the chip. This provides theoretical support for the reliability assessment of electronic package solder joints and holds practical value for enhancing the overall reliability of electronic packaging components. Full article

This study investigates the potential application of Zn5Al1.5Mg1.5Ti active solder in ultrasonic soldering of Al₂O₃ ceramics and Cu substrates. The research explores the microstructural characteristics, phase composition, and mechanical properties of the solder and the resulting joints. Particular attention is given to the formation mechanisms of the solder–substrate bond and the role of ultrasound activation in enhancing wettability and bond strength. The study aimed to provide a deeper understanding of active soldering processes and their suitability for high-temperature applications. The findings contribute to advancing lead-free soldering technologies for electronic and structural applications. Full article

The very high cycle fatigue (VHCF) strength of welded joints made of high-strength structural materials is generally poor, which poses a serious threat to the long life and reliability of the structural components. This work employs an ultrasonic vibration fatigue testing system to investigate the biaxial fatigue failure mechanism of the welded joints. The results revealed that under uniaxial loading conditions, the propensity for fatigue failure in plate specimens was predominantly observed at the specimen surface. Regardless of whether under uniaxial or biaxial loading, the initiation of fatigue cracks in cruciform joints was consistently traced back to unfused flaws, which were primarily located at the interface between the solder and the base material. Concurrently, it was noted that the fatigue strength of cruciform joints under biaxial loading was merely 44.4% of that under uniaxial loading. The geometric peculiarities of the unfused defects led to severe stress concentrations, which significantly reduced the fatigue life of the material under biaxial loading conditions. Full article

Adhesive joints are some of the oldest inseparable connections, and were used much earlier than other non-separable connections (e.g., welded, soldered). Adhesives are widely used in the manufacture of vehicles, household appliances, aircraft, and medicine. One disadvantage of adhesive joints is their long bonding time (amounting, for example, to 72 h for polyurethane adhesives used in bus roof bonding), and another is their production of harmful waste. Tapes that are adhesive coated on both sides are increasingly being used to join parts during production. Such tapes have lower strength than traditional adhesives, but their bonding time is much shorter. In addition, the amount of waste remaining after production is minimized. Tapes, like adhesives, dampen vibrations well and seal the materials being joined. The purpose of this study was to evaluate the influence of selected factors on the quality of tape–steel sheet joints and to assess the possibility of testing acrylic tape–steel sheet joints using ultrasonic methods. It was found that the preparation of a surface for bonding has a significant effect on the quality of the joint, and it was confirmed that non-destructive evaluation of the quality of the tested joints by the ultrasonic method is possible. The decibel drop in the height of the first and fifth pulses obtained on the screen of the ultrasonic defectoscope was proposed as an ultrasonic measure. The highest-quality joints were characterized by a measure in the range of 12 dB, lower-quality areas of about 8 dB, and tape-free areas of about 5 dB. At the same time, it was noted that in the case of proper surface preparation, there was cohesive failure of the joint during breakage. Full article

In order to achieve the non-destructive testing and quality evaluation of stainless-steel resistance spot welding (RSW) joints, a portable ultrasonic spiral C-scan testing instrument was developed based on the principle of ultrasonic pulse reflection. A mathematical model for the quality evaluation of RSW joints was established, and the centroid of the ultrasonic C-scan image in the nugget zone of the RSW was determined based on the principle of static moment. The longest and shortest axes passing through the centroid in the image were extracted, and the ratio of the longest axis to the shortest axis (RLS) factor and the average of axis (AOA) factor were calculated, respectively, to evaluate the quality of the joint. To study the effectiveness of the detection results, tensile tests, and stereo analysis were conducted on the solder joints after sampling. The results indicate that this detection method can realize online detection and significantly improve the detection efficiency; the detection value of internal defect size is close to the true value with an error of 0.1 mm; the combination of RLS and AOA factors can be used to evaluate the mechanical properties of RSW joints. This technology can be used to solve the NDT, evaluate problems of RSW joints, and realize engineering applications. Full article

To address the issues of high cost, low welding efficiency, and complex processes in vacuum brazing, we proposed a method of electromagnetic ultrasonic (EU)-assisted brazing with Al-12Si solder to join SiC ceramic and TC4 alloy. The results showed that the maximum magnetic induction strength (MIS) on the surface of the liquid solder was 0.629 T when subjected to a static and alternating magnetic field (MF). Additionally, the combined action of MF and eddy current generated a downward Lorentz force (LF) in the liquid solder, with the maximum LF in the horizontal and vertical directions being 48.91 kN m⁻³ and 60.93 kN m⁻³, respectively. Under the influence of an EU wave, the liquid solder exhibited capillary filling (CF) behavior. At 26 ms, the maximum length of CF was 12.21 mm. Full article

The aim of this study was to characterize a Zn-Mg type soldering alloy and direct soldering of SiC ceramics with a copper substrate. The Zn1.5Mg solder exerts a wider melting interval. The temperature of the eutectic reaction was 365 °C, and the liquidus temperature was 405 °C. The microstructure of the soldering alloy is comprised of a zinc matrix. Segregation of binary eutectics in the form of (Zn) + Mg₂Zn₁₁ lamellas occurred on the boundaries of Zn grains. Additionally, the presence of a MgZn₂ magnesium phase was observed in the solder matrix. The SiC/solder bond was formed due to magnesium distribution from solder to the boundary with SiC ceramics, where magnesium reacts with silicon, which is infiltered in SiC ceramics. By a mutual interaction, a new Mg₂Si phase is formed. An interaction between the molten zinc solder and Cu substrate occurred on the boundary of the Cu/substrate joint at the formation of a transition zone composed of two new phases, namely the γCu (Cu₅Zn₈) non-wettable phase type, approximately 30 µm wide, and a wettable (CuZn₄) phase type ε, approximately 12 µm wide. The average shear strength of a combined SiC/Cu joint fabricated using Zn1.5Mg solder was 44 MPa. Full article

The current article presents an advanced analysis of the properties of solid-wire electric contacts produced with ultrasonic welding and soldering. Soldering is generally used to join thin, solid copper wires to produce electrical contacts in small-volume production, as ultrasonic welding does not provide acceptable peel force and tensile strength due to the deformation and thinning of the wires. In this article, ultrasonic welding of thin, solid copper wires using a ring before and after a thermal shock test is discussed and compared with the standard soldering technique. The thermal shock test was carried out in the temperature range from −30 to 150 °C. Half of the samples, for both the joining techniques and the wires, were subjected to the thermal shock test; the other half were not. Investigations included electrical resistance tests, optical and SEM microscopy, XRD, microhardness measurements, peel tests, tensile tests, and fractographic analysis. The electrical resistance test, microscopy, microhardness measurements, and fracture examinations showed no differences between the thermal shock-exposed and the non-exposed samples with the same joining process. In mechanical tests, the ultrasonic joint demonstrated superior strength compared to the soldered joint. Full article

Although magnesium alloys show potential as structural and functional materials, they are difficult to join using traditional welding methods because of their low melting points and active chemical properties. Their poor weldability impedes their universal application. Ultrasound-assisted transient liquid-phase bonding (U-TLP) is a novel method used for magnesium alloy bonding, but in almost all related studies, a heating device has been required, and the types of solders are limited. In this study, gallium was used as solder to bond AZ31 magnesium alloy with ultrasonic assistance at room temperature (without a heating device) due to the low melting temperature of gallium and its compatibility with other metals when forming intermetallic compounds (IMCs). The variations in the products, microstructure, fracture characteristics, and shear strength of the joints were investigated. A reliable joint composed of IMCs (Mg₂Ga₅, H-MgGa₂, and Mg₂Ga) and a eutectic structure was obtained after an ultrasonic duration of 3 s. Significantly, the plasticity of the joint was improved due to ultrasonic effects, which included the accelerated element diffusion process, the refinement of grains to nanometer particles, and the homogenization of organization. Thus, the highest shear strength of 14.65 MPa at 4 s was obtained, with obvious cleavage fracture characteristics in the region of the IMCs. Full article

Conventional methods for producing porous metals involve the use of chemicals such as thickeners and foaming agents under high temperatures and pressures. However, these methods are costly and pose a risk of dust explosion. Thus, the objective of this research is to achieve the cost-effective and safe production of porous metals by introducing microbubbles generated by ultrasonic oscillation into the molten metal. One end of an ultrasonic horn was inserted into three different molten metals—white metal, Pb-free solder, and zinc—and microbubbles were generated at the horn end by the strong ultrasonic oscillation in the molten metals. The microbubbles that contained molten metal changed phase to porous metal through solidification, and the diameter, porosity, and stress–strain curve of the generated porous metals were measured. The results indicate that the porosity of white metal, Pb-free solder, and zinc foams reached 54%, 76%, and 48%, respectively, and these porous metals had many micropores less than 1 mm in diameter. It was also observed that the higher the melting point, the larger the pore diameter and the lower the porosity. Furthermore, in the case of white metal, a plateau region of large deformation at constant stress was observed in the stress–strain curve. Full article

The aim of the research was to characterize the soldering alloy type Zn-Mg-Sr and direct the soldering of SiC ceramics with Cu-SiC-based composite. It was investigated whether the proposed composition of the soldering alloy was appropriate for soldering those materials at the defined conditions. For the determination of the solder melting point, TG/DTA analysis was applied. The Zn-Mg system is of the eutectic type with a reaction temperature of 364 °C. The effect of strontium on the phase transformation was minimal, owing to its lower content. The microstructure of the soldering alloy type Zn3Mg1.5Sr is formed of a very fine eutectic matrix containing segregated phases of strontium—SrZn₁₃ and magnesium—MgZn₂ and Mg₂Zn₁₁. The average tensile strength of the solder is 98.6 MPa. The tensile strength was partially increased by solder alloying with magnesium and strontium. The SiC/solder joint was formed due to the distribution of magnesium from the solder to the boundary with the ceramics at the formation of a phase. Owing to soldering in air, oxidation of the magnesium took place and the oxides formed were combined with the silicon oxides that remained on the surface of the ceramic material—SiC. Thus, a strong bond based on oxygen was obtained. An interaction between the liquid zinc solder and the copper matrix of the composite substrate took place at the formation of a new phase—γCu (Cu₅Zn₈). The shear strength was measured on several ceramic materials. The average shear strength of the combined SiC/Cu-SiC joint fabricated with Zn3Mg1.5Sr solder was 62 MPa. When soldering similar ceramic materials mutually, a shear strength of as much as around 100 MPa was observed. Full article

This research aimed to study a Bi–Ag–Mg soldering alloy and the direct soldering of Al₂O₃ ceramics and Ni–SiC composites. Bi11Ag1Mg solder has a broad melting interval, which mainly depends on the silver and magnesium content. The solder starts to melt at a temperature of 264 °C. Full fusion terminates at a temperature of 380 °C. The microstructure of the solder is formed by a bismuth matrix. The matrix contains segregated silver crystals and an Ag (Mg, Bi) phase. The average tensile strength of solder is 26.7 MPa. The boundary of the Al₂O₃/Bi11Ag1Mg joint is formed by the reaction of magnesium, which segregates in the vicinity of a boundary with a ceramic substrate. The thickness of the high-Mg reaction layer at the interface with the ceramic material was approximately 2 μm. The bond at the boundary of the Bi11Ag1Mg/Ni–SiC joint was formed due to the high silver content. At the boundary, there were also high contents of Bi and Ni, which suggests that there is a NiBi₃ phase. The average shear strength of the combined Al₂O₃/Ni–SiC joint with Bi11Ag1Mg solder is 27 MPa. Full article

The application of Sn-Bi series solder is limited due to the brittleness of Bi phase. Sn-20Bi solder with less Bi element content has great research prospects, but it needs modification to make it a substitute for traditional Sn-Pb solder. In this article, we mixed graphene nanosheets with nanometer Sn powder by means of ultrasonic oscillation, and Sn-20Bi-qGNS (q = 0.01, 0.02, 0.04, 0.06, and 0.1 wt.%) solder alloys were prepared by the melt-casting method. The effects of graphene nanosheets (GNSs) on the microstructure, physical properties, mechanical properties, and corrosion resistance of solder alloys were investigated. Scanning electron microscopy, energy dispersive spectroscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to determine the microstructural morphology and composition. The results showed that the melting point, density, and wettability of the solder decreased slightly with the addition of GNSs. The addition of GNSs as a second phase refined the solder structure and improved the tensile strength of the molten Sn-20Bi composite solder to 99.6 MPa, while elongation decreased with the addition of GNSs. Furthermore, GNSs prevented the MC Sn-20Bi-qGNSs/Cu intermetallic compound layers’ growth by interfering with atomic diffusion and grain boundary movement. In addition, the addition of 0.02 wt.% GNSs enhanced the shear strength of MC Sn-20Bi solder joints to 46.3 MPa. The electrochemical experimental results show that the surface corrosion products of MC Sn-20Bi-qGNSs under 3.5% NaCl solution were Sn₃O(OH)₂Cl₂, with MC Sn-20Bi-0.01GNSs exhibiting the best corrosion resistance. Full article

Usually for non-destructive testing at high temperatures, ultrasonic transducers made of PZT and silver electrodes are used, but this could lead to damage to or malfunction of the ultrasonic transducer due to poor adhesion between PZT and silver. Soldering is one of the most common types of bonding used for individual parts of ultrasonic transducers (protector, backing, matching layer, etc.), but silver should be protected using additional metal layers (copper) due to its solubility in solder. A mathematical modelling could help to predict if an ultrasonic transducer was manufactured well and if it could operate up to 225 °C. The observed von Mises stresses were very high and concentrated in metal layers (silver and copper), which could lead to disbonding under long-term cyclic temperature loads. This paper presents a multilayer ultrasonic transducer (PZT, silver electrodes, copper layers, backing), which was heated evenly from room temperature to 225 °C and then cooled down. In the B-scan, it was observed that the amplitude of the reflected signal from the bottom of the sample decreased with an increase in temperature. However, after six heating–cooling cycles, the results repeated themselves and no signs of fatigue were noticed. This ultrasonic transducer was well manufactured and could be used for non-destructive testing when the environment temperature changes in cycles up to 225 °C. Full article