Search Results (28)

Fast, spark-free detection of hydrogen leaks is indispensable for large-scale hydrogen deployment, yet electronic sensors remain power-intensive and prone to cross-talk. Optical schemes based on surface plasmons enable remote read-out, but single-metal devices offer either weak H2 affinity or poor plasmonic quality. Here we employ full-wave finite-difference time-domain (FDTD) simulations to map the hydrogen response of nanohole arrays (NAs) that can be mass-produced by colloidal lithography. Square lattices of 200 nm holes etched into 100 nm films of Pd, Mg, Ti, V, or Zr expose an intrinsic trade-off: Pd maintains sharp extraordinary optical transmission modes but shifts by only 28 nm upon hydriding, whereas Mg undergoes a large dielectric transition that extinguishes its resonance. Vertical pairing of a hydride-forming layer with a noble metal plasmonic cap overcomes this limitation. A Mg/Pd bilayer preserves all modes and red-shifts by 94 nm, while the predicted optimum Ag (60 nm)/Mg (40 nm) stack delivers a 163 nm shift with an 83 nm linewidth, yielding a figure of merit of 1.96—surpassing the best plasmonic hydrogen sensors reported to date. Continuous-film geometry suppresses mechanical degradation, and the design rules—noble-metal plasmon generator, buried hydride layer, and thickness tuning—are general. This study charts a scalable route to remote, sub-ppm, optical hydrogen sensors compatible with a carbon-neutral energy infrastructure. Full article

A low-profile dual-polarized shared-aperture phased array antenna is proposed for Ku-band satellite communications in this paper. The stacked octagonal patches loaded with Via-rings are proposed as dual-polarized shared-aperture radiation elements, with the characteristics of wide impedance bandwidth, high gain, and weak coupling. Furthermore, innovative minimized three-port ring couplers are utilized for the differential-fed antenna array, further suppressing the cross-polarization component. Substrate integrated coaxial line (SICL) and microstrip line (MS) feed networks are employed for the excitation of transmitting band (Tx) horizontal polarization and receiving band (Rx) vertical polarization, respectively. The non-uniform subarray architecture is optimized to minimize the sidelobe levels with the reduced number of transmitter and receiver (T/R) radio frequency phase-shifting modules. As proof-of-concept examples, 16 × 24 and 32 × 24 array antennas are demonstrated and fabricated. The measured impedance bandwidths of the proposed phased array antennas are around 21.1%, while the in-band isolations are above 36.7 dB. Gains up to 29 dBi and 32.4 dBi are performed by two prototypes separately. In addition, the T/R phase-shifting modules are utilized to validate the beam-scanning characteristic, which is of value for dynamic satellite communications. Full article

A millimeter-wave multi-layer and miniaturized multibeam antenna fed by an E-plane Butler matrix (BM) in substrate integrated waveguide (SIW) technology is proposed. For the beam-forming network (BFN), a folded E-plane 4 × 4 BM is proposed, whose basic components are stacked up along the vertical direction aiming to reduce the horizontal size by more than 75% compared with a single-layer BM. For the radiation portion, an unconventional slot antenna array arranged in a ladder type is adopted. The slot antenna elements are distributed in separate layers, making them more compatible with the presented BM and are arranged in the longitudinal direction to suppress the mutual coupling effect. Furthermore, the BM has been adjusted to accommodate the slot antenna array and obtain further miniaturization. The overall dimension of the designed multibeam antenna, taking the BFN into account, is 12 mm × 45 mm × 2 mm (1.2 λ × 4.5 λ × 0.2 λ), which is preferable for future 6G smartphone applications. The impacts of the air gap in fabrication are also taken into consideration to alleviate the error between simulated model and fabricated prototype. Full article

In this paper, a novel 2D Nolen beamforming phased array with 3D scanning capability to achieve high channel capacity is presented for multiple-input multiple-output (MIMO) Internet-of-Things (IoT) applications. The proposed 2D beamforming phased array is designed by stacking a fundamental building block consisting of a 3 × 3 tunable Nolen matrix, which applies a small number of phase shifters with a small tunning range and reduces the complexity of the beam-steering control mechanism. Each 3 × 3 tunable Nolen matrix can achieve a full 360° range of progressive phase delay by exciting all three input ports, and nine individual radiation beams can be generated and continuously steered on azimuth and elevation planes by stacking up three tunable Nolen matrix in horizontal and three in vertical to maximize signal-to-noise ratio (SNR) in the corresponding spatial directions. To validate the proposed design, the simulations have been conducted on the circuit network and assessed in a fading channel environment. The simulation results agree well with the theoretical analysis, which demonstrates the capability of the proposed 2D Nolen beamforming phased array to realize high channel capacity in MIMO-enabled IoT communications. Full article

This study introduces a novel approach for fabricating vertically stacked mini-LED arrays, integrating InGaN yellow and blue epitaxial layers with a stress buffer layer to enhance optoelectronic characteristics and structural stability. This method significantly simplifies the LED design by reducing the need for RGB configurations, thus lowering costs and system complexity. Employing vertical stacking integration technology, the design achieves high-density, efficient white light production suitable for multifunctional applications, including automotive lighting and outdoor signage. Experimental results demonstrate the exceptional performance of the stacked yellow and blue mini-LEDs in terms of luminous efficiency, wavelength precision, and thermal stability. The study also explores the performance of these LEDs under varying temperature conditions and their long-term reliability, indicating that InGaN-based yellow LEDs offer superior performance over traditional AlGaInP yellow LEDs, particularly in high-temperature environments. This technology promises significant advancements in the design and application of lighting systems, with potential implications for both automotive and general illumination markets. Full article

A multi-layer stacked Dynamic Random Access Memory (DRAM) platform is introduced to address the memory wall issue. This platform features high-density vertical interconnects established between DRAM units for high-capacity memory and logic units for computation, utilizing Wafer-on-Wafer (WoW) hybrid bonding and mini Through-Silicon Via (TSV) technologies. This 3DIC architecture includes commercial DRAM, logic, and 3DIC manufacturing processes. Their design documents typically come from different foundries, presenting challenges for signal integrity design and analysis. This paper establishes a lumped circuit based on 3DIC physical structure and calculates all values of the lumped elements in the circuit model with the transmission line model. A Cross-Process Signal Integrity Analysis (CPSIA) method is introduced, which integrates three different manufacturing processes by modeling vertical stacking cells and connecting DRAM and logic netlists in one simulation environment. In combination with the dedicated buffer driving method, the CPSIA method is used to analyze 3DIC impacts. Simulation results show that the timing uncertainty introduced by 3DIC crosstalk ranges from 31 ps to 62 ps. This analysis result explains the stable slight variation in the maximum frequency observed in vertically stacked memory arrays from different DRAM layers in the physical testing results, demonstrating the effectiveness of this CPSIA method. Full article

In this article, a 1 × 4 wideband, dual-polarized patch antenna array fed by a novel, differentially fed structure is proposed. The differentially fed structure of the antenna was realized by a parallel line structure that was printed on a PCB and connected with the inner and outer conductors of a coaxial cable. This method elaborately solved the problem of the narrow bandwidth of conventional microstrip differential feeding. By using a relatively thick air substrate (thickness = 0.19 λ₀), stacked patches, a coupling feeding structure, and a differential feeding structure with the novel design, the element of the patch antenna array introduced below operated from 0.415 GHz to 0.707 GHz (achieving the 52.0% bandwidth) with a VSWR < 2.0, yielding a high port isolation less than −28 dB. For the array, an active VSWR less than 2.0 was also obtained with a port isolation of less than −25 dB, ranging from 0.405 GHz to 0.696 GHz. In the desired bandwidth, the array had an azimuth 3 dB beamwidth of about 19° for both horizontal polarization and vertical polarization. The antenna array also had good performance in scanning (stable gain and 3 dB beamwidth) and circular polarization (a 3 dB axial ratio bandwidth better than 54.5%). Full article

Silicon nanowires (SiNWs) are emerging as versatile components in the fabrication of sensors for implantable medical devices because of their exceptional electrical, optical, and mechanical properties. This paper presents a novel top-down fabrication method for vertically stacked SiNWs, eliminating the need for wet oxidation, wet etching, and nanolithography. The integration of these SiNWs into body channel communication (BCC) circuits was also explored. The fabricated SiNWs were confirmed to be capable of forming arrays with multiple layers and rows. The SiNW-based pH sensors demonstrated a robust response to pH changes, and when tested with BCC circuits, they showed that it was possible to quantize based on pH when transmitting data through the human body. This study successfully developed a novel method for SiNW fabrication and integration into BCC circuits, which could lead to improvements in the reliability and efficiency of implantable medical sensors. The findings demonstrate significant potential for bioelectronic applications and real-time biochemical monitoring. Full article

A novel approach to fabricating a transparent and flexible one-transistor–one-diode (1T-1D) image sensor array on a flexible colorless polyimide (CPI) film substrate is successfully demonstrated with laser lift-off (LLO) techniques. Leveraging transparent indium tin oxide (ITO) electrodes and amorphous indium gallium zinc oxide (a-IGZO) channel-based thin-film transistor (TFT) backplanes, vertically stacked p-i-n hydrogenated amorphous silicon (a-Si:H) photodiodes (PDs) utilizing a low-temperature (<90 °C) deposition process are integrated with a densely packed 14 × 14 pixel array. The low-temperature-processed a-Si:H photodiodes show reasonable performance with responsivity and detectivity for 31.43 mA/W and 3.0 × 10¹⁰ Jones (biased at −1 V) at a wavelength of 470 nm, respectively. The good mechanical durability and robustness of the flexible image sensor arrays enable them to be attached to a curved surface with bending radii of 20, 15, 10, and 5 mm and 1000 bending cycles, respectively. These studies show the significant promise of utilizing highly flexible and rollable active-matrix technology for the purpose of dynamically sensing optical signals in spatial applications. Full article

The extension of low-earth orbit (LEO) services to non-terrestrial mobile communications has huge potential for eliminating network white spots and providing high-speed, low-latency links with worldwide geographic coverage. State-of-the-art user terminals for mobile platforms are too large for integration into a passenger vehicle. Antenna elements loaded with a dielectric superstrate could potentially lead to a considerable miniaturization of the user terminal. As per link budget calculations, an array with a gain of 27 dBi is necessary to ensure a throughput of 25 Mbps in the downlink at the Ku-band. A conventional array with a gain of 6 dBi per element, assuming a 12 × 12 arrangement with half-wavelength spacing, would require a footprint of 36 λ² at 10 GHz to achieve this target and appears unsuitable for automotive integration. This paper proposes a low-profile, dual-band, dual-polarized, vertically stacked patch antenna with superstrate loading and shows that the inclusion of the superstrate improves the antenna’s gain by at least 3 dB. Therefore, compared to a conventional array, a superstrate-loaded array would need only half of the number of elements to meet the target gain, thus occupying only half of the surface area, and offers better integration for automotive applications. Requiring half of the number of elements also implies considerably reduced design complexity and cost. Full article

This paper reports on the design and experimental validation of a fully-metallic double-ridged waveguide 10 × 10 Rotman lens additively manufactured as a single part. The wide band operation of this quasi-optical beamformer enables us to cover the uplink and downlink frequencies allocated to satellite communications in the K/K${}_{\mathrm{a}}$-band, from 17.3 GHz to 30 GHz. The feeding port design was adjusted to enable vertical printing, thus minimizing the use of supporting structures. A prototype was manufactured and tested. The reported results indicate losses in the range of 0.5 dB in the lower-frequency band and 0.8 dB in the upper-frequency band, including the waveguide transitions added for test purposes. The measured reflection and coupling coefficients remain below −11.5 dB over the operating band. The standard deviation of the residual phase error across the array ports is below $5°$ in simulation and below $10°$ in measurements. Array factors synthesized using the scattering parameters confirm the good stability of the beamforming functionality over the wide frequency band analyzed. This monolithic design is a promising step toward more integrated antenna systems, such as a compact dual-stack configuration for planar array design. Full article

In this article, we propose a light weight, low profile Multiple Input Multiple Output (MIMO) antenna system for compact 5th Generation (5G) mmwave devices. Using a RO5880 substrate that is incredibly thin, the suggested antenna is made up of circular rings stacked vertically and horizontally on top of one another. The single element antenna board has dimensions of 12 × 12 × 0.254 mm${}^3$ while the size of the radiating element is 6 × 2 × 0.254 mm${}^3$ (0.56$\lambda$${}_0$ × 0.19$\lambda$${}_0$ × 0.02$\lambda$${}_0$). The proposed antenna showed dual band characteristics. The first resonance showed a bandwidth of 10 GHz with a starting frequency of 23 GHz to an ending frequency point of 33 GHz followed by a second resonance bandwidth of 3.25 GHz ranging from 37.75 to 41 GHz, respectively. The proposed antenna is transformed into a four element Linear array system with size of 48 × 12 × 0.254 mm${}^3$ (4.48$\lambda$${}_0$ × 1.12$\lambda$${}_0$ × 0.02$\lambda$${}_0$). The isolation levels at both resonance bands were noted to be >20 dB which shows high levels of isolation among radiating elements. The MIMO parameters such as Envelope Correlation Co-efficient (ECC), Mean Effective Gain (MEG) and Diversity Gain (DG) were derived and were found to be in satisfactory limits. The proposed MIMO system model is fabricated and through validation and testing of the prototype, the results were found to be in good agreement with simulations. Full article

Short-fiber-reinforced polymers (SFRPs) based on unidirectionally arrayed chopped strands (UACSs) have excellent formability and outstanding mechanical response. The low-velocity impact response, such as the delamination, damage tolerance and energy absorption of UACS composites, are essential to guarantee the stability and safety of composite components in service. The current study investigates the low-velocity impact response of continuous carbon-fiber-reinforced polymer (CFRP) and UACS laminates with vertical slits under drop-weight impact with various impact energies (4, 7 and 11 J). The in-plane size of the studied samples is 100 mm × 100 mm, and the stacking sequence is [0/90]_4s. The time–history curves of load and energy are examined during low-velocity impact experiments, as well as the nonvisible damages are obtained by ultrasound C-scan imaging technique. A user-defined subroutine VUMAT, including the Johnson–Cook material and failure model, which is used to simulate the elastic–plastic property of the slits filled with resin, is coded in ABAQUS/Explicit. According to C-scan inspections of the impact-damaged laminates, UACS specimens show more severe delamination as impact energy increases. The damaged area of continuous CFRP laminates under impact energy of 11 J is 311 mm², while that of UACS laminates is 1230 mm². The slits have a negative effect on the load-bearing capacity but increase the energy absorption of UACS laminates by approximately 80% compared to the continuous CFRP laminates at 7 J. According to the variables of different damage modes in numerical simulation, cracks appear at the slits and then expand along the direction perpendicular to the slits, leading to the fracture of fiber. Nevertheless, as the damage expands to the slits, the delamination confines the damage propagation. The existence of slits could guide the path of damage propagation. Full article

As the demands for improved performance of integrated circuit (IC) chips continue to increase, while technology scaling driven by Moore’s law is becoming extremely challenging, if not impractical or impossible, heterogeneous integration (HI) emerges as an attractive pathway to further enhance performance of Si-based complementary metal-oxide-semiconductor (CMOS) chips. The underlying basis for using HI technologies and structures is that IC performance goes well beyond classic logic functions; rather, functionalities and complexity of smart chips span across the full information chain, including signal sensing, conditioning, processing, storage, computing, communication, control, and actuation, which are required to facilitate comprehensive human–world interactions. Therefore, HI technologies can bring in more function diversifications to make system chips smarter within acceptable design constraints, including costs. Over the past two decades or so, a large number of HI technologies have been explored to increase heterogeneities in materials, technologies, devices, circuits, and system architectures, making it practically impossible to provide one single comprehensive review of everything in the field in one paper. This article chooses to offer a topical overview of selected HI structures that have been validated in CMOS platforms, including a stacked-via vertical magnetic-cored inductor structure in CMOSs, a metal wall structure in the back end of line (BEOL) of CMOSs to suppress global flying noises, an above-IC graphene nano-electromechanical system (NEMS) switch and nano-crossbar array electrostatic discharge (ESD) protection structure, and graphene ESD interconnects. Full article

The contribution of this work is to propose a half-mode substrate integrated coaxial resonator (HMSICR) and its application in bandpass filter (BPF) design. The proposed HMSICR is formed by evenly bisecting a square substrate integrated coaxial resonator (SICR), which is a cavity composed of two dielectric substrates and three metal layers. The SICR’s sidewalls are mimicked by periodically spaced thru-via arrays, and a circular patch is embedded in the middle metal layer of the SICR with the patch shorted to the cavity’s bottom wall by a circular array of blind vias. This HMSICR can drastically lower the cavity’s resonance frequency. The achieved frequency reduction rate of the proposed HMSICR, as compared with that of its conventional substrate integrated waveguide (SIW) cavity counterpart, reaches 70%. A sample four-HMSICR BPF is built for the circuit verification measurement. To further reduce the sample filter’s area, the composing HMSICRs are vertically stacked in a back-to-back configuration. We believe that its obtained size-reduction rate reaches the highest record. Full article