MEMS Sensors and Resonators, 2nd Edition

Abstract submission deadline

31 October 2026

Manuscript submission deadline

31 December 2026

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Topic Information

Dear Colleagues,

In recent years, microelectromechanical systems (MEMSs) have seen significant development and revolutionized the functionalities of many systems in chemical, biological, and physical applications. Thanks to the increased reliability and adaptability of MEMS devices, MEMS technology has the potential to create new opportunities in many miniaturization applications. MEMS sensors can be found everywhere, from electronic appliances to medical diagnostics, due to their compact size and reliable performance. MEMS resonators have also been the subject of significant research and commercial interest and are widely used in applications including sensing, timing applications, filtering, etc.

Following on from the success of the initial Topic on “MEMS Sensors and Resonators”, we are pleased to launch the second edition. This Topic aims to highlight the latest developments, emerging challenges, and innovative applications in MEMS-based sensors and resonators.

In this Topic, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following:

• Microfabrication technology;
• Design of novel MEMS sensors;
• Modeling of MEMS systems;
• Flexible MEMS sensors;
• BioMEMS sensors;
• Fluidic MEMS;
• Acoustic wave-based sensors and resonators;
• Microresonators;
• Pressure sensors;
• Inertial measurement unit.

We look forward to receiving your contributions.

Dr. Fabio Di Pietrantonio
Dr. Lanju Mei
Topic Editors

Keywords

Participating Journals

Journal Name	Impact Factor	CiteScore	Launched Year	First Decision (median)	APC
Applied Sciences applsci	2.5	6.1	2011	16 Days	CHF 2400	Submit
Electronics electronics	2.6	7.0	2012	16.4 Days	CHF 2400	Submit
Eng eng	2.4	4.1	2020	18 Days	CHF 1400	Submit
Micromachines micromachines	3.0	7.1	2010	16.8 Days	CHF 2100	Submit
Nanomanufacturing nanomanufacturing	-	-	2021	23.5 Days	CHF 1000	Submit
Sensors sensors	3.5	9.4	2001	17.8 Days	CHF 2600	Submit

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Published Papers (2 papers)

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All Applied Sciences Electronics Eng Sensors Nanomanufacturing Micromachines

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27 pages, 3877 KB  

Open AccessArticle

Reliability Assessment of MEMS Gyroscopes via Dual-Mechanism Synergistic Degradation: A Generalized Linear Model with Physics-Informed Wiener Processes

by Pengbin Yang, Zhen Liu, Yuhang Liang, Xinfeng Guo and Hang Geng

Sensors 2026, 26(12), 3774; https://doi.org/10.3390/s26123774 (registering DOI) - 12 Jun 2026

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Abstract

As the core sensor of inertial measurement units, the reliability of Micro-Electro-Mechanical Systems (MEMS) gyroscopes is critical for long-term navigation and motion control applications. To bridge the mechanism-data gap in MEMS multi-mechanism degradation modeling, this paper proposes a physics-informed dual-indicator reliability assessment framework [...] Read more.

As the core sensor of inertial measurement units, the reliability of Micro-Electro-Mechanical Systems (MEMS) gyroscopes is critical for long-term navigation and motion control applications. To bridge the mechanism-data gap in MEMS multi-mechanism degradation modeling, this paper proposes a physics-informed dual-indicator reliability assessment framework based on Wiener processes. Two degradation indicators under consideration are frequency-related degradation caused by stiffness degradation and Q-factor degradation caused by damping degradation, for which corresponding physics-embedded stochastic degradation models are formulated. The two indicators are normalized and fused through a generalized weighted limit state function, where failure is defined as gyroscope-level performance failure. Closed-form reliability expressions are derived for linear limit states, while Monte Carlo simulation is used for nonlinear cases. Reduced-order multiphysics simulation cases, including a double-ended fixed beam and a cantilevered MEMS mass block, are used to demonstrate the mechanism-to-indicator-to-reliability modeling procedure. The results show that the proposed dual-indicator framework provides more balanced reliability assessment than single-indicator analysis under the simulation setting. The proposed method offers an alternative mechanism-informed approach for reliability analysis and lifetime prediction of other MEMS devices. Full article

(This article belongs to the Topic MEMS Sensors and Resonators, 2nd Edition)

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12 pages, 4198 KB  

Open AccessArticle

Simulation Analysis and Characteristic Research of High-Performance SAW Devices with Trapezoidal Piezoelectric Structures

by Zhipeng Ma, Shijun He, Zhangrui Duan, Lishuang Liu, Jing Zeng and Feng Li

Micromachines 2026, 17(6), 705; https://doi.org/10.3390/mi17060705 - 9 Jun 2026

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Abstract

The electromechanical coupling factor (K²) is one of the key parameters characterizing the performance of surface acoustic wave (SAW) devices. Conventional SAW structures suffer from a spatial mismatch between mechanical energy and electric fields, which severely limits improvements in K [...] Read more.

The electromechanical coupling factor (K²) is one of the key parameters characterizing the performance of surface acoustic wave (SAW) devices. Conventional SAW structures suffer from a spatial mismatch between mechanical energy and electric fields, which severely limits improvements in K². To address this limitation, this paper proposes a novel microstructure based on trapezoidal etching of the piezoelectric layer. First, an Al/ZnO/Si trapezoidal etching model was established for simulation studies. The results show that trapezoidal etching reduces mechanical energy leakage and enhances the spatial overlap with electric fields. Subsequently, by varying the bottom width (S_ZnO), the variation of K² under three etching shapes (standard trapezoidal, rectangular, and inverted trapezoidal) was investigated. The results indicate that trapezoidal etching significantly enhances K², which gradually increases as S_ZnO decreases. Under the theoretical limit (S_ZnO = 0.1 μm), K² reaches a maximum of 14.34%, representing a 19-fold improvement over the conventional structure. Simultaneously, the figure of merit (FOM) and insertion loss (S₂₁) are also remarkably improved. Finally, considering practical manufacturing constraints, this paper discusses the configurations of S_ZnO = 0.2 μm and 0.4 μm, revealing that the performance of the SAW devices remains significantly enhanced in both cases, thereby providing a practically feasible solution for the design and fabrication of high-performance SAW devices. Full article

(This article belongs to the Topic MEMS Sensors and Resonators, 2nd Edition)

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