Dear Colleagues,

Thermoelectric modules are used for thermal-to-electrical energy conversion and heat management including refrigeration, cooling, heating, thermal switching, and designing active heat sinks. Passive heat transfer in these modules via conduction within the elements, but also from the side walls via radiation and convection, is important to include when modeling and designing these modules. The electronic component of passive heat transfer via electrons, holes, and bipolar transport, also within the module, adds to the complexity of the problem. In their active mode, under both electric current and temperature gradients, the active components, including the Peltier and Thomson currents and Joule heating, provide knobs to manipulate heat for various applications. The thermal integration of the thermoelectric modules with the heat source, heat sink, and ambient environment is essential in accurate heat management.

This Special Issue focuses on heat management and heat transfer in the context of thermoelectric modules. The Seebeck coefficient, which the basic idea of thermoelectricity relies on, is the average entropy carried by electrons. In a sense, a thermoelectric module is designed to modify the entropy of the integrated system. We invite papers considering materials design, device design, and applications with an emphasis on heat and entropy transfer.

Dr. Mona Zebarjadi
Dr. Sepideh Akhbarifar
Dr. Md Golam Rosul
Guest Editors

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• heat transfer
• thermoelectric materials
• thermoelectric devices
• thermal conductivity
• heat management
• cooling and refrigeration
• power generation
• magneto-thermoelectric