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Ultra-Precision Machining Technology and Equipments
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Ultra-Precision Machining Technology and Equipments

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".

Deadline for manuscript submissions: closed (20 November 2024) | Viewed by 6643

Special Issue Editors

Dr. Junfeng Liu

E-Mail Website
Guest Editor
Laboratory of Science and Technology on Integrated Logistics Support, College of Intelligence Science and Technology, National University of Defense Technology, Changsha 410073, China
Interests: ion beam processing; timed grinding; rotor dynamics; hemispherical harmonic oscillator; optimization
Prof. Dr. Xiaoqiang Peng

E-Mail Website
Guest Editor
Laboratory of Science and Technology on Integrated Logistics Support, College of Intelligence Science and Technology, National University of Defense Technology, Changsha 410073, China
Interests: magnetorheological processing; ultra-precision turning; optical load; optical and mechanical design; metallic mirror
Dr. Tao Lai

E-Mail Website
Guest Editor
Laboratory of Science and Technology on Integrated Logistics Support, College of Intelligence Science and Technology, National University of Defense Technology, Changsha 410073, China
Interests: ultra precision measurement; precision design; error separation and compensation; in place measurement

Special Issue Information

Dear Colleagues,

At the forefront of high-end technology development, advanced precision machining and manufacturing technology has become the mainstream and is rapidly developing into a science that studies various high-precision manufacturing processes and methods. It involves the interdisciplinary integration of machinery, optics, materials, physics, and other disciplines and is widely used in consumer electronics, security, home appliances, automobiles, medical treatment, astronomy, industrial testing, national defense, aerospace and other industries.

Dr. Junfeng Liu
Prof. Dr. Xiaoqiang Peng
Dr. Tao Lai
Guest Editors

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Keywords

  • ultra-precision machining
  • optical manufacturing
  • ultra-precision measurement
  • extreme processing technology
  • surface accuracy
  • interferometric measurement
  • contour scanning measurement

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Published Papers (7 papers)

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Research

13 pages, 7910 KiB  
Article
Research on Nanometer Precision Measurement Method of High Order Even Aspheres
by Hao Xu, Junfeng Liu and Shanyong Chen
Appl. Sci. 2024, 14(21), 9969; https://doi.org/10.3390/app14219969 - 31 Oct 2024
Viewed by 562
Abstract
Optical aspheres are demanded with extremely high precision to meet functional requirements in space telescopes, extreme ultraviolet lithography, and other modern large optical systems. The nano-precision fabrication of optical aspheres requires high-precision measurements to guide deterministic optical processing. Null test is the preferred [...] Read more.
Optical aspheres are demanded with extremely high precision to meet functional requirements in space telescopes, extreme ultraviolet lithography, and other modern large optical systems. The nano-precision fabrication of optical aspheres requires high-precision measurements to guide deterministic optical processing. Null test is the preferred method for high-precision measurements. Null optics are required to compensate for the incident wavefront in the null test of optical aspheres. However, wavefront aberrations caused by the transmission flat or transmission sphere of interferometer and null optics can limit measurement accuracy and need to be separated. A nano-precision measurement method is proposed for the even optical aspheres of high order in this paper. A computer-generated hologram is used as a null optic to realize a null test on optical aspheres. Mapping distortion correction is performed on the measurement results to ensure that the transverse coordinates of the measurement results correspond correctly to those of the test surface. Absolute testing is applied to separate the wavefront aberrations caused by the computer-generated hologram and interferometer optics. Finally, the results obtained by this method were used to guide deterministic optical processing, enabling the nano-precision fabrication of optical aspheres. Full article
(This article belongs to the Special Issue Ultra-Precision Machining Technology and Equipments)
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12 pages, 4359 KiB  
Article
Research on Subsurface Damage Measurement of Fused Silica in Ultra-Precision Grinding Based on Laser Damage Performance
by Yaoyu Zhong, Mingjin Xu, Wenjun Kuang, Fubin Wan, Zhifan Lin, Yansong Fan, Qingqing Hu and Fufang Xu
Appl. Sci. 2024, 14(13), 5379; https://doi.org/10.3390/app14135379 - 21 Jun 2024
Viewed by 913
Abstract
In order to achieve accurate prediction of subsurface damage (SSD) in ultra-precision grinding of high-performance ultra-violet laser-irradiated fused silica optics, the paper combines damage precursor multimodal measurement technology with magnetorheological finishing spot method detection. Various methods such as photothermal weak absorption and fluorescence [...] Read more.
In order to achieve accurate prediction of subsurface damage (SSD) in ultra-precision grinding of high-performance ultra-violet laser-irradiated fused silica optics, the paper combines damage precursor multimodal measurement technology with magnetorheological finishing spot method detection. Various methods such as photothermal weak absorption and fluorescence confocal imaging are used for measuring the surface roughness and subsurface damage depth of a series of fused silica samples prepared under different ultra-precision grinding parameters. The correlation between surface roughness and subsurface damage depth in ultra-precision grinding based on laser damage performance is established using curve fitting. The results indicate that there is a metamorphic layer below the subsurface crack layer, which can cause additional photothermal absorption. Subsurface damage is constituted of the subsurface crack layer and metamorphic layer. Under ultra-precision grinding conditions, the maximum depth of subsurface damage is generally 2.00–4.22 times the depth of the subsurface damage cluster. The roughness Ra and the subsurface damage cluster depth correspond to SSD(cluster) = 195 × Ra − 0.13. The maximum depth of subsurface damage can be predicted by measuring the Ra value, by which accurate prediction of defect depth in ultra-precision grinding and guiding the high-performance manufacturing of ultra-violet laser-irradiated fused silica optics can be achieved. Full article
(This article belongs to the Special Issue Ultra-Precision Machining Technology and Equipments)
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13 pages, 8666 KiB  
Article
Enhanced Wear Resistance of Microstripe-Textured Water-Lubricated Materials Fabricated via Hot Embossing
by Zeyun Li, Weibin Wu, Xue Yang and Xin Wang
Appl. Sci. 2024, 14(11), 4625; https://doi.org/10.3390/app14114625 - 28 May 2024
Viewed by 851
Abstract
Water-lubricated material is the fundamental ingredient of a water-lubricated bearing (WLB), of which the friction and wear properties directly affect the working performance and service life of a WLB. We designed a micron-scale stripe texture and fabricated a negative microtexture mold by femtosecond [...] Read more.
Water-lubricated material is the fundamental ingredient of a water-lubricated bearing (WLB), of which the friction and wear properties directly affect the working performance and service life of a WLB. We designed a micron-scale stripe texture and fabricated a negative microtexture mold by femtosecond laser etching. The microtextures were fabricated onto the surface of Thordon and polyurethane water-lubricated materials by a precision thermoforming machine. Tribological tests showed that the microstripe texture on water-lubricated materials had lower friction and wear properties than that on pristine surface materials. The results demonstrated that the presence of the microstripe texture effectively improved the friction and anti-wear properties of the water-lubricated materials. This study provides a new idea for the design and preparation of water-lubricated materials with good water-lubricating and anti-wear properties. Full article
(This article belongs to the Special Issue Ultra-Precision Machining Technology and Equipments)
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10 pages, 1582 KiB  
Article
Mechanism of Surface Hydroxylation Acceleration and Laser-Induced Damage Threshold Reduction during Ion Beam Sputtering of Fused Silica
by Mingjin Xu, Weibin Wu, Yongsheng Ke, Xiaohong Liu, Yaoyu Zhong and Xiaopeng Gao
Appl. Sci. 2024, 14(11), 4550; https://doi.org/10.3390/app14114550 - 25 May 2024
Viewed by 927
Abstract
The mechanism of the combined process of ion beam sputtering (IBS) and HF acid etching on the chemical structure defects of fused silica and its laser damage resistance performance were investigated in this paper. During the removal process of surface material, the sputtering [...] Read more.
The mechanism of the combined process of ion beam sputtering (IBS) and HF acid etching on the chemical structure defects of fused silica and its laser damage resistance performance were investigated in this paper. During the removal process of surface material, the sputtering effect causes lattice atoms to flee their native space locations, and a large amount of unsaturated chemical structures are produced on the silica surface, which improves the chemical activity of Si and O atoms, accelerates the chemical reaction process between surface atoms and water molecules, increases the content of hydroxyl groups (OH-) in the shallow layer, and enhances the photothermal weak absorption intensity. However, the increase in hydroxyl content weakens the binding strength of silicon–oxygen bonds, destroys the spatial network structure of silica bulk, and reduces its mechanical strength, resulting in a decrease in its laser damage resistance performance. The paper reveals for the first time the mechanism by which IBS changes the structure characteristics of silica material, accelerates the surface hydroxylation process, and thereby reduces the laser damage resistance performance. This work provides technical guidance for effectively suppressing chemical structure defects on silica surfaces and improving the laser damage resistance performance of optical components under high-flux laser irradiation. Full article
(This article belongs to the Special Issue Ultra-Precision Machining Technology and Equipments)
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13 pages, 4496 KiB  
Article
Mitigating the Impact of Asymmetric Deformation on Advanced Metrology for Photolithography
by Wenhe Yang, Shuxin Yao, Jing Cao and Nan Lin
Appl. Sci. 2024, 14(11), 4440; https://doi.org/10.3390/app14114440 - 23 May 2024
Viewed by 1010
Abstract
Controlling overlay in lithography is crucial for improving the yield of integrated circuit manufacturing. The process disturbances can cause undesirable morphology changes of overlay targets (such as asymmetric grating), which can significantly impact the accuracy of overlay metrology. It is essential to decouple [...] Read more.
Controlling overlay in lithography is crucial for improving the yield of integrated circuit manufacturing. The process disturbances can cause undesirable morphology changes of overlay targets (such as asymmetric grating), which can significantly impact the accuracy of overlay metrology. It is essential to decouple the overlay target asymmetry from the wafer deformation, ensuring that the overlay metrology is free from the influence of process-induced asymmetry (e.g., grating asymmetry and grating imbalance). Herein, we use an asymmetric grating as a model and show that using high-diffraction-order light can mitigate the impact of asymmetric grating through the rigorous coupled-wave analysis (RCWA) method. In addition, we demonstrate the diffraction efficiency as a function of the diffraction order, wavelength, and pitch, which has guiding significance for improving the measurement accuracy of diffraction-based overlay (DBO) metrology. Full article
(This article belongs to the Special Issue Ultra-Precision Machining Technology and Equipments)
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14 pages, 2025 KiB  
Article
Facile Fabrication of Superhydrophobic and Superoleophilic Polyurethane Foil with Micropillar and Microporous Structures for Efficient Oil/Water Separation
by Weibin Wu, Mingjin Xu, Qinqin Wang, Xue Yang and Changgeng Shuai
Appl. Sci. 2024, 14(9), 3935; https://doi.org/10.3390/app14093935 - 5 May 2024
Cited by 1 | Viewed by 927
Abstract
Oil spill cleanup in water remains a critical challenge due to the harmful secondary pollution from conventional methods such as burning or chemical degradation. Herein, we present a facile method to fabricate a superhydrophobic and superoleophilic polyurethane (PU) foil for efficient and environmentally [...] Read more.
Oil spill cleanup in water remains a critical challenge due to the harmful secondary pollution from conventional methods such as burning or chemical degradation. Herein, we present a facile method to fabricate a superhydrophobic and superoleophilic polyurethane (PU) foil for efficient and environmentally friendly oil/water separation. More specifically, micropillar arrays were embedded onto the foil surface through a nanoimprinting process. Microporous structures were generated at the foil cross-section by a supercritical carbon dioxide (CO2) saturation method. The dimensions of pillar and pore structures were optimized with the aim of boosting selective wetting (i.e., water repellency and oil attraction) properties. As a result, the developed PU foil shows an oil absorption efficiency nearly 4 times higher than a pristine reference. Moreover, the structured PU foil stably retains the absorbed oil for over a week, demonstrating an absorption capacity of nearly 400%, which is also much superior than the unstructured sample. Our concept of combining both topographical micropillars and cross-sectional micropores onto PU foil provides a novel approach for achieving efficient and environmental friendly oil/water separation. Full article
(This article belongs to the Special Issue Ultra-Precision Machining Technology and Equipments)
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15 pages, 29693 KiB  
Article
Computer-Aided Analysis of the Formation of the Deformation Zone in the Burnishing Process
by Andrzej Piotrowski, Andrzej Zaborski and Artur Tyliszczak
Appl. Sci. 2024, 14(3), 1062; https://doi.org/10.3390/app14031062 - 26 Jan 2024
Cited by 1 | Viewed by 835
Abstract
The study presents the use of spatial imaging of the shape of the deformation formation area occurring at the point of contact between the burnished tool and the processed material surface in the burnishing process. In the analysis of changes in the shape [...] Read more.
The study presents the use of spatial imaging of the shape of the deformation formation area occurring at the point of contact between the burnished tool and the processed material surface in the burnishing process. In the analysis of changes in the shape of surfaces processed by ball and disc pressure burnishing, an integrated measurement station was used to measure surface stereometry (New Form Talysurf 2D/3D 120 by Taylor Hobson) and to carry out a series of axially shifted roundness measurements (Talyrond 365 by Taylor Hobson). The geometric parameters of the deformation zone determined in the direction of the circumference of the cylindrical surface (direction of the main movement) and in the axial direction (in the feed plane) are presented. The data obtained as a result of metrological measurements were analysed using specialized computer software. Full article
(This article belongs to the Special Issue Ultra-Precision Machining Technology and Equipments)
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