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Feature Paper Collection in the Section ‘Electrical, Electronics and Communications Engineering’

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".

Deadline for manuscript submissions: 31 May 2025 | Viewed by 43

Special Issue Editors


E-Mail Website
Guest Editor
Institute of Metrology, Electronics and Computer Science, University of Zielona Gora, 65-417 Zielona Gora, Poland
Interests: logic synthesis; FSM design; FPGA; ASIC; CPLD; embedded systems
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Institute of Metrology, Electronics and Computer Science, University of Zielona Gora, 65-417 Zielona Gora, Poland
Interests: logic synthesis; FSM design; FPGA; ASIC; telecommunications; antenna arrays; hardware–software co-design; CAD of VLSI-based digital systems
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Department of Technology, The Jacob of Paradies University, ul. Teatralna 25, 66-400 Gorzow Wielkopolski, Poland
Interests: distributed embedded systems; embedded system design; IoT; hardware synthesis; process control

Special Issue Information

Dear Colleagues,

As you know, virtually every aspect of human functioning depends significantly on the widespread use of advances in electrical, electronic, and telecommunications engineering. Over the past decade, “Electrical, Electronics and Communications Engineering” of Applied Sciences has published many papers dedicated to the fundamental and applied aspects of these three important disciplines.

This Special Issue “Feature Paper Collection in the section ‘Electrical, Electronics and Communications Engineering’”, to be published in 2024–2025, will present a collection of feature papers on recent developments in these areas of science.

We are seeking papers related (but not limited) to the following:

  1. Fundamental problems of modern electrical engineering.
  2. Fundamental problems of modern electronic engineering.
  3. Fundamental problems of telecommunication systems.
  4. Development and use of mathematical models to simulate components and their interaction within electrical circuits and systems.
  5. Development of new tools of circuit analysis.
  6. Prevention of interference between different electrical components or systems.
  7. Automatization of the step of component selection.
  8. Development of tools for preventing the effect of voltage drop.
  9. Reducing circuit noise.
  10. Improving the power quality of circuits and systems.
  11. Development of tools for protection from overvoltage.
  12. Development of tools for lightning protection.
  13. Improving heat managing in circuits and systems.
  14. Using troubleshooting techniques in design.
  15. Improving signal processing.
  16. Signal processing and communication techniques in modern electrical engineering.
  17. Emerging trends in electrical engineering.
  18. Development methods aimed at Smart Grids.
  19. Development of telecommunication tools aimed in 5G Networks.
  20. Development of telecommunication tools providing secure and reliable services.
  21. Development and using artificial intelligence (AI) tools for telecommunication systems.
  22. Using machine learning applications in telecommunication systems.
  23. Development of telecommunication tools oriented on Internet of Things.
  24. Development of Machine to Machine (M2M) devices.
  25. Using cloud computing in telecommunications.
  26. Decentralized telecom networks.
  27. Virtualized network services in telecommunications.
  28. Using new wireless technologies in telecommunications.
  29. Development of tools for defence from cyberattacks.
  30. Using green technologies in telecommunication systems.

For this Special Issue, we seek papers that feature original research, as well as review articles. The journal offers high-quality peer review and a rapid publication process. Submission to this Special Issue is now open and will be open until March 31, 2025. Invited papers may be considered for full or partial waiver of the publication cost. If you would like to be invited to contribute to this Special Issue, please send the (tentative) title and abstract of your potential paper/review to one of the two Co-Guest Editors listed below. We look forward to receiving insightful contribution.

Prof. Dr. Alexander Barkalov
Prof. Dr. Larysa Titarenko
Dr. Kazimierz Krzywicki
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electrical engineering
  • electronics
  • telecommunications
  • analysis
  • improvement

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Published Papers

This special issue is now open for submission.
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