Emerging Electronic Device Materials
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: closed (15 February 2024) | Viewed by 1710
Special Issue Editor
Interests: power electronic system control strategy; reliability and electromagnetic compatibility; condition monitoring for power electronics; power semiconductor module thermal modeling
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Electronic materials are widespread in modern society. This Special Issue will include a large variety of materials and related device technologies, such as nanostructures, conventional semiconductors (Si, Ge, SiGe, GaAs, etc.), wide-bandgap semiconductors (SiC, GaN, Ga2O3, ZnO, AlN, diamond, etc.), heterostructures, nanowires, 2D materials and compounds, optical and energy harvesting materials, etc. In addition, the development and application of advanced characterization techniques for electronic materials and devices are also in line with the scope of this SI. The topics of interest include, but are not limited to, the following:
- Dielectric and ferroelectric materials;
- Optoelectronic materials;
- Thermoelectric materials;
- Wide-bandgap semiconductor devices；
- Organic semiconductors and their devices;
- Spintronic materials, devices and instrumentation;
- 2D materials and novel devices;
- Organic and perovskite electronic devices.
Prof. Dr. Mingxing Du
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- power electronic device reliability
- wide-bandgap semiconductor devices
- 2D materials
- electronic devices
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