Application of Smart Gel Material in Flexible and Wearable Electronics

Dear Colleagues,

This Special Issue, entitled “Application of Smart Gel Material in Flexible and Wearable Electronics”, focuses on developing advanced gel materials for utilization in flexible and wearable electronic devices. With the growing demand for flexible and stretchable electronics, smart gel materials have emerged as promising candidates due to their distinctive properties, including flexibility, their capacity for self-healing, and electrical conductivity. This Special Issue aims to explore the recent advancements in the synthesis, characterization, and application of smart gel materials for flexible and wearable electronics.

The Special Issue discusses the synthesis and fabrication methods employed with regard to smart gel materials for flexible and wearable electronics. It also discusses the importance of gel materials in enabling the development of lightweight, stretchable, and durable electronic devices that can conform to complex shapes and withstand mechanical deformation. The Special Issue also addresses the challenges and future perspectives in the field, including developing novel gel formulations, enhancing their electrical conductivity, and optimizing their self-healing capabilities.

Overall, this Special Issue aims to provide comprehensive insights into the development of smart gel materials for flexible and wearable electronics. The research within this Special Issue will contribute to the advancement of electronic devices that can be seamlessly integrated into everyday life, enabling the widespread adoption of wearable technologies and expanding the potential applications of flexible electronics.

Dr. Massimo Mariello
Dr. Mazeyar Parvinzadeh Gashti
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Gels is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• smart gel materials
• flexible electronics
• wearable electronics
• gel synthesis
• material characterization
• electrical conductivity
• self-healing capability
• stretchability
• sensor technology
• energy harvesting