Wound Repair: From Basic Biology to Tissue Engineering
A special issue of International Journal of Molecular Sciences (ISSN 1422-0067). This special issue belongs to the section "Molecular Biology".
Deadline for manuscript submissions: 30 June 2025 | Viewed by 321
Special Issue Editor
Interests: drug delivery systems; controlled drug release; biopolymers; mucoadhesive carrier; pharmaceutical technology
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The field of wound repair has advanced significantly, encompassing fundamental biological mechanisms to sophisticated tissue engineering strategies. This Special Issue aims to bridge the gap between basic research on and translational applications in wound healing and tissue regeneration. It will focus on the cellular and molecular dynamics of wound repair, including inflammation, angiogenesis, extracellular matrix remodeling, and stem cell involvement. Additionally, it will explore the latest developments in biomaterials, 3D bioprinting, and bioactive scaffolds tailored for enhanced healing. By integrating perspectives from basic biology, clinical challenges, and engineering innovations, this Special Issue seeks to foster interdisciplinary collaboration and advance the development of next-generation solutions for acute and chronic wounds. Submissions covering experimental research, reviews, and cutting-edge technologies are welcome, particularly those that illuminate mechanisms, novel therapies, and their clinical implications.
This Special Issue is supervised by Professor Judyta Cielecka-Piontek and Dr. Magdalena Paczkowska-Walendowska.
Dr. Magdalena Paczkowska-Walendowska
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. International Journal of Molecular Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. There is an Article Processing Charge (APC) for publication in this open access journal. For details about the APC please see here. Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- wound healing
- tissue engineering
- biomaterials
- regenerative medicine
- chronic wounds
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue policies can be found here.