Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
5.2
3.0
Journals
Micromachines
Special Issues
Two-Dimensional Materials for Electronic and Optoelectronic Devices
share announcement

Two-Dimensional Materials for Electronic and Optoelectronic Devices

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 31 October 2024 | Viewed by 639

Special Issue Editor

Dr. Kuibo Yin

E-Mail Website
Guest Editor
SEU-FEI Nano-Pico Center, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 210096, China
Interests: memristor; 2D materials fabrication and device; in situ TEM
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Two-dimensional (2D) materials have garnered significant attention in recent years due to their unique properties and potential applications in various devices. These materials, which are only a few atoms thick, exhibit exceptional mechanical, electrical, and optical properties that make them promising candidates for next-generation electronic and optoelectronic devices. Researchers and engineers are actively exploring novel ways to incorporate 2D materials into existing technologies to enhance performance, reduce energy consumption, and enable new functionalities. As research in this field continues to advance, the potential for transformative breakthroughs in device design and functionality is becoming increasingly evident.

Accordingly, this Special Issue seeks to showcase research papers, communications, and review articles that focus on the current state of the art in 2D materials research and highlight the exciting possibilities for future device applications.

We look forward to receiving your submissions!

Dr. Kuibo Yin
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 2D material fabrication and characterization
  • electronic devices based on 2D materials
  • optoelectronic device based on 2D materials

Published Papers (1 paper)

Order results
Result details
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:

Research

20 pages, 11059 KiB  
Article
Size-Effect-Based Dimension Compensations in Wet Etching for Micromachined Quartz Crystal Microstructures
by Yide Dong, Guangbin Dou, Zibiao Wei, Shanshan Ji, Huihui Dai, Kaiqin Tang and Litao Sun
Micromachines 2024, 15(6), 784; https://doi.org/10.3390/mi15060784 - 14 Jun 2024
Viewed by 427
Abstract
Microfabrication technology with quartz crystals is gaining importance as the miniaturization of quartz MEMS devices is essential to ensure the development of portable and wearable electronics. However, until now, there have been no reports of dimension compensation for quartz device fabrication. Therefore, this [...] Read more.
Microfabrication technology with quartz crystals is gaining importance as the miniaturization of quartz MEMS devices is essential to ensure the development of portable and wearable electronics. However, until now, there have been no reports of dimension compensation for quartz device fabrication. Therefore, this paper studied the wet etching process of Z-cut quartz crystal substrates for making deep trench patterns using Au/Cr metal hard masks and proposed the first quartz fabrication dimension compensation strategy. The size effect of various sizes of hard mask patterns on the undercut developed in wet etching was experimentally investigated. Quartz wafers masked with initial vias ranging from 3 μm to 80 μm in width were etched in a buffered oxide etch solution (BOE, HF:NH4F = 3:2) at 80 °C for prolonged etching (>95 min). It was found that a larger hard mask width resulted in a smaller undercut, and a 30 μm difference in hard mask width would result in a 17.2% increase in undercut. In particular, the undercuts were mainly formed in the first 5 min of etching with a relatively high etching rate of 0.7 μm/min (max). Then, the etching rate decreased rapidly to 27%. Furthermore, based on the etching width compensation and etching position compensation, new solutions were proposed for quartz crystal device fabrication. And these two kinds of compensation solutions were used in the fabrication of an ultra-small quartz crystal tuning fork with a resonant frequency of 32.768 kHz. With these approaches, the actual etched size of critical parts of the device only deviated from the designed size by 0.7%. And the pattern position symmetry of the secondary lithography etching process was improved by 96.3% compared to the uncompensated one. It demonstrated significant potential for improving the fabrication accuracy of quartz crystal devices. Full article
(This article belongs to the Special Issue Two-Dimensional Materials for Electronic and Optoelectronic Devices)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying articles 1-1
Back to TopTop