Acoustic Transducers and Their Applications, 2nd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: 31 March 2025 | Viewed by 66

Special Issue Editors


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Guest Editor
School of Microelectronics, Shanghai University, Shanghai 200444, China
Interests: piezoelectric material; MEMS device process; piezoelectric transducer design; acoustic sensing model; acoustic device algorithm and system-level application
Special Issues, Collections and Topics in MDPI journals
School of Microelectronics, Shanghai University, Shanghai 200444, China
Interests: piezoelectric material and devices; MEMS; acoustic transducer; acoustic sensor

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Guest Editor
College of Information, Mechanical and Electrical Engineering, Shanghai Normal University, Shanghai 200234, China
Interests: intelligent sensing technology and system; RF micro-acoustic devices for mobile communication; modeling and simulation of piezoelectric thin-film micro-acoustic devices
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Institute of High Performance Computing, A*STAR, Singapore 138632, Singapore
Interests: piezoelectric transducer design and simulation; piezoelectric material property extraction; bulk acoustic wave (BAW) devices; acoustic meta-surfaces (including meta-lens); beam steering
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Acoustics represent a key form of mechanical energy that is exerted everywhere in our world. It aid in sensing, actuating, and communicating, even in medical or industrial matters. With a broad operating spectrum, it is the most pivotal tool in various implementations, ranging from airborne applications to studies through different media, especially for needs beyond the physical limitations of other mechanisms (e.g., optical or electromagnetic waves). Alongside the progression of advanced transducer technology, more acoustic device alternatives have been optimized for conventional applications. In addition, consistent research efforts in the field of developing transducers enable rapid paradigmatic shifts in many emerging acoustic applications, which coherently accelerate the development of other peripheral technologies, such as thin-film materials used in acoustic transducers, circuits for acoustic devices, modules, algorithms, system integration, and even the integration of acoustic sensors into smart systems. In order to promote research efforts and advocate for continuous innovation in this field, in this Special Issue, the current state of the art in the field of ‘acoustic transducers and their applications’ will be presented, covering a wide range of related topics, including, but not limited to, the following:

  • New piezoelectric materials: ceramics, thin films, single crystals, polymers, composites, 2D materials, etc.;
  • Acoustic transducers: acoustic sensors and actuators, circuits for acoustic devices, modules, algorithms, and integrated systems;
  • Piezoelectric devices/acoustic transducers: fabrication, testing, characterization, design, modeling, simulation, manufacturing, 3D printing, packaging, and system integration;
  • Acoustic transducer applications: nondestructive testing, acoustic arrays for holograms and beam steering, acoustic ranging, acoustic lenses, meta-materials and meta-surfaces, energy harvesting, medical imaging, wearable sensors, biomedical applications, virtual reality/augmented reality, and other emerging applications for the metaverse.

Dr. Songsong Zhang
Dr. Liang Lou
Dr. Qiaozhen Zhang
Dr. Xing Haw Marvin Tan
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • acoustic transducers and their design, simulation, testing, and characterization
  • piezoelectric MEMS device
  • thin-film piezoelectric materials and material properties
  • MEMS integration process
  • acoustic modules, algorithms, circuits, and systems
  • acoustic lenses and meta-surfaces
  • acoustic transducer arrays and their applications
  • implementation and usage of acoustic devices for various applications

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Published Papers

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