Search Results (96)

We evaluated for the morphology and growth behavior of IMC grain according to number of reflows of solder cap pure Sn microbumps. In the structure of Ni barrier/Cu layer between Cu pillar and pure Sn, solder cap pure Sn on the top layer was analyzed for the behavior change of IMC grain according to the number of reflows. The height and diameter of the bumps on the wafer were designed to be 40 μm and 30 μm, respectively. The vertical structure of the microbump consisted of Ti/Cu (1000 Å/2000 Å), Cu pillar (20 µm), Ni barrier (3 µm), and Cu (1 µm). The overall height of the bump is about 40 μm. Additionally, the height of the solder cap pure Sn as the last layer is 20 μm. The diameter of the bump is 30 μm. It was formed using plating. After plating to solder cap Sn, it was finally formed for the microbump using reflow. Samples were prepared according to the number of reflows (1, 3, 5, 7, and 9). To observe the grain morphology of the IMC, the pure Sn on the upper layer (solder cap) was removed using SupraBond RO-22 etchant. In the removed state, the morphology of the IMC grain was evaluated to the inside surface of bump using SEM and a 3D scope. The average number of IMC grains decreased linearly during reflow cycles 1 to 5 and then gradually decreased during reflow cycles 7 to 10. The average surface area of IMC grains was 18.243 μm when reflow was performed once. The average surface area of IMC grains increased proportionally for reflow cycles 1 to 10. Based on the experimental results, when the count of reflow was performed more than 10 times, it was confirmed that the solder cap pure Sn was reduced by more than 50% due to the increase in the area of IMC grain. Full article

To enhance the grinding performance and service life of rail grinding wheels, a novel brazed–resin composite wheel was developed by embedding brazed CBN (cubic boron nitride) segments into a resin working layer. The brazed CBN segments were fabricated using a Cu–Sn–Ti + WC (tungsten carbide) composite filler via a cold-press forming–vacuum brazing process. Microstructural and phase analyses revealed the formation of Ti–B and Ti–N compounds at the CBN–filler interface, indicating metallurgical bonding, while the incorporation of WC reduced excessive wetting, enabling precise shape retention of the segments. Comparative laboratory and field grinding tests were conducted against conventional resin-bonded wheels. Under all tested pressures, the composite wheel exhibited lower grinding temperatures, generated predominantly strip-shaped chips with lower oxygen content, and produced fewer spherical oxide-rich chips than the resin-bonded wheel, confirming reduced thermal load. Field tests demonstrated that the composite wheel matched the resin-bonded wheel in grinding efficiency, extended service life by approximately 28.8%, and achieved smoother rail surfaces free from burn-induced blue marks. These results indicate that the brazed–resin composite grinding wheel effectively leverages the superior hardness and thermal conductivity of CBN abrasives, offering improved thermal control, wear resistance, and surface quality in rail grinding applications. Full article

Cu-20Pb-5Sn/45 steel bimetallic composites were prepared using the solid–liquid composite method. The interfacial microstructure, bonding strength, and wear performance were systematically characterized to elucidate the mechanisms governing the solid-solution interface and copper alloy layer wear behavior. The results reveal that mutual diffusion of Cu and Fe forms a metallurgically bonded α-(Cu,Ni)/α-Fe interface with a diffusion layer thickness of approximately 10.7 µm and an interfacial shear strength of 227.58 MPa. Under dry sliding conditions, the average coefficient of friction was 0.145, with a wear rate of 7.3665 × 10⁻⁶ mm³/(N·m). The α-(Cu,Ni) matrix was reinforced by hard Cu₃P and Ni-rich phases, which resist frictional shear stresses, while dispersed Pb particles provide self-lubricating properties, while the solid-solution interface hindered dislocation propagation, reducing dislocation pile-up and ensuring stable frictional performance. Full article

Using molecular dynamics (MDs) simulations with Materials Studio 8.0 software, we systematically investigated the adsorption and aggregation behaviors of silicon, tin, and copper atoms on the surface of (7,7) single-walled carbon nanotubes (SWCNTs). Silicon, tin, and copper were selected due to their distinct bonding characteristics—covalent (Si), semi-metallic (Sn), and metallic (Cu)—and their relevance in potential composite interface applications such as energy storage, thermal management, and electronics. The results indicate that silicon atoms form multi-layered concentric shells; however, the rigidity of their covalent bonds makes the resulting structures susceptible to disruption by local density fluctuations. Tin atoms form a limited number of stable concentric shells benefiting from the flexibility of their semi-metallic bonds. In contrast, copper atoms rapidly aggregate into disordered clusters due to their high diffusivity and metallic bonding. Within the confined geometry of the carbon nanotubes, all three types of atoms exhibit a tendency toward spiral growth, but their regularity depends on the properties of their chemical bonds, leading to distinct spiral features. These findings are further supported by linear density and radial distribution function (RDF) analyses. Full article

The electronic structures and optical properties of Mn-doped, Co-doped, and (Mn,Co)-co-doped Cu₂ZnSnS₄ were calculated and analyzed using the first-principles pseudopotential plane-wave approach. The results indicate that doping with Mn or Co increases the bond population and decreases the bond length of the S-Mn and S-Co bonds, respectively, enhancing their covalent character. The undoped Cu₂ZnSnS₄ exhibits a bandgap of 0.16 eV, whereas doping with Mn or Co introduces impurity levels near the Fermi level, resulting in bandgap narrowing. Within the visible light spectrum, the static dielectric constant ε₁(0) reaches its maximum value of 67.7 under co-doping conditions, and the absorption coefficient also attains its maximum value of 6.7 × 10⁴ cm⁻¹ under co-doping. Doping with Mn and Co induces a redshift (shift towards lower energy) in both the absorption peaks and dielectric function peaks, concomitantly increasing the probability of photon-induced electronic transitions. Conversely, doping shifts the reflectivity peaks towards higher energies (blue-shift), with the most pronounced blue-shift occurring under co-doping; the strongest reflectivity peaks remain below 43%. A prominent conductivity peak is observed at 1.7 eV. Doping shifts this peak position towards lower energies, with the maximum peak intensity reaching 1.6. These findings collectively suggest that Mn and Co doping effectively modulate key optical properties of Cu₂ZnSnS₄, such as its band gap and absorption coefficient, constituting an effective strategy for enhancing its optoelectronic transport characteristics. Full article

Third-generation wide-bandgap (WBG) semiconductor power electronics exhibit excellent workability, but high-temperature packaging technology limits their applications. TLP, TLPS, and nanoparticle sintering have the potential to achieve a high-temperature-resistant joint at a lower bonding temperature. However, a long bonding time, voids in the joint, powder oxidation, and organic solvent residues impede their application. A novel interlayer and other approaches have been proposed, such as preformed Sn-coated Cu foam (CF@Sn), a Cu-Sn nanocomposite interlayer, self-reducible Cu nanoparticle paste, bimodal-sized Cu nanoparticle pastes, organic-free nanoparticle films, and high-thermal-conductivity and low-CTE composite paste. Their preparation, bonding processes, and joint properties are compared in this paper. Full article

To address solder paste drawbacks, such as die contamination and flux residue, a polymer-based sheet containing Sn-3.0 (wt%) Ag-0.5Cu solder particles as fillers was fabricated, and its bonding characteristics were analyzed. The reductant in the manufactured sheet evaporated while removing the oxide layers on the solder and copper finish surfaces during heating. Subsequently, the resin component (polymethyl methacrylate) began to decompose thermally and gradually dissipated. Ultimately, the resulting joint formed a solder interconnection with a small amount of residual resin. This joint is expected to exhibit superior thermal conductivity compared with composite joints with a polymer matrix structure. Die-attach tests were conducted in air using the fabricated sheet between Cu finishes. Results showed that joints formed at 300 °C for 30 s and 350 °C for 10 s provided excellent shear strength values of 48.0 and 44.3 MPa, respectively, along with appropriately developed intermetallic compound (IMC) layers at the bonding interface. In contrast, bonding at 350 °C for 60 s resulted in excessive growth of IMC layers at the interface. When comparing size effects of solder particles, type 6 particles exhibited superior shear strength along with a relatively thinner total IMC layer thickness compared to when type 7 particles were used. Full article

The self-healing characteristics of Al6061 reinforced with CuO have been examined experimentally. The solder alloys 60Pb40Sn and 99.3Sn0.7Cu with low melting points are incorporated to strengthen the Al6061 MMCs’; the self-healing properties have been investigated. Developed self-healing samples have undergone testing for hardness, tensile, and impact characteristics in accordance with ASTM standard test protocols. The findings demonstrate how the solder filling affects the mechanical characteristics of self-healed Al6061 alloy and its MMCs’. The results showed that the composites formed a decent bond between the solder and matrix, confirming successful fabrication. Pb-Sn filled samples demonstrated higher self-healing efficiency for tensile and impact of 90.02% and 90.30% with 6 wt.% of CuO, respectively, and Sn-Cu filled samples witnessed higher self-healing efficiency for tensile and impact of 91.81% and 91.09% with 6 wt.% of CuO respectively. However, the self-healed composite did not split in two when subjected to Charpy impact and tensile strength tests, and the healing efficiency of Sn-Cu-filled composites is higher than that of the Pb-Sn-filled composites. Full article

In this study, an interconnection was formed between a Cu/SnAg pillar bump and an Ni-less surface-treated Cu pad through laser-assisted bonding (LAB), and its bonding characteristics were evaluated. The LAB process influences the bond quality and mechanical strength based on the laser irradiation time and laser power density. The growth of the intermetallic compound (IMC) in the joint cross-section was observed via FE-SEM analysis. Under optimized LAB conditions, minimal IMC growth and high bonding strength were achieved compared to conventional thermo-compression bonding (TCB) and mass reflow (MR) processes. As the laser irradiation time and laser power density increased, solder splashing was observed at bump temperatures above 300 °C. This is hypothesized to be due to the rapid temperature rise causing the flux to vaporize explosively, resulting in simultaneous solder splashing. With increasing laser power density, the failure mode transitioned from the solder to the IMC. Full article

The co-addition of chromium (Cr) and tin (Sn) is known to enhance the wettability between copper (Cu) and graphite (C_gr), but the effect of Sn content remains poorly understood. This study aims to systematically investigate the influence of Sn content a (a = 0, 10, 20, 30, 40, 50, 80, 99 at. %) on the wettability, interfacial structure, surface/interface energy (σ_lv/σ_sl), and adhesion behavior of the Cu–aSn–1Cr/C_gr system at 1100 °C. The experimental results show that as the Sn content increases, the equilibrium contact angle (θ_e) of the metal droplet shows a non-monotonic trend; the thickness of the reaction product layer (RPL, consisting of Cr carbides (Cr_mC_n)) gradually increases, accompanied by a decrease in the calculated adhesion work ($W_{\mathrm{ad}}^{\mathrm{cal}}$). A “sandwich” interface structure is observed, consisting of two interfaces: metal||Cr_mC_n and Cr_mC_n||C_gr. Sn content mainly affects the former. At metal||Cr_mC_n, Sn exists in various forms (e.g., Cu–Sn solid solution, Cu_xSn_y compounds) in contact with Cr_mC_n. To elucidate the wetting and bonding mechanisms of metal||Cr_mC_n, simplified interfacial models are constructed and analyzed based on first-principles calculations of density functional theory (DFT). The trend of theoretically calculated results (σ_metal and W_ad) agrees with the experimental results (σ_lv and $W_{\mathrm{ad}}^{\mathrm{cal}}$). Further analysis of the partial density of state (PDOS) and charge density difference (CDD) reveals that charge distribution and bonding characteristics vary with Sn content, providing the microscopic insight into the nature of wettability and interfacial bonding strength. Full article

Transient liquid-phase bonding (TLPB) enables the low-temperature fabrication of encapsulated solder joints with high-temperature resistance and electromigration resilience; yet, Ni-Sn TLPB joints suffer from brittle fracture due to intermetallic compounds (IMCs). This study investigates the Co, Cu, and Pt alloying effects on Ni₃Sn via formation energy, molecular dynamics, and first-principles calculations. Occupancy models of Ni_6−xM_xSn₂ (M = Co, Cu, and Pt) were established, with the lattice parameters, B/G ratios, fracture toughness (K_IC), and stress–strain behaviors analyzed. The results reveal that Co enhances fracture toughness and reduces Ni₃Sn anisotropy, mitigating microcrack risks, while Cu/Pt introduce antibonding interactions (Cu–Sn and Pt–Sn), weakening the bonding strength. The classical B/G brittleness criterion proves inapplicable in Ni–M–Sn systems due to mixed bonding (metallic/covalent) and the hexagonal structure’s limited slip systems. The Ni_6−xCo_xSn₂ formation improves toughness with a low Co content, supported by an electronic structure analysis (density of states and Bader charges). The thermodynamic stability and reduced molar shrinkage (Ni + Sn → Ni₃Sn) confirm Co’s efficacy in optimizing Ni–Sn solder joints. Full article

To address the critical applications of heterogeneous structures involving nickel-based superalloys (IN718) and copper alloys (CuSn10) under extreme operating conditions, and to address the limitations of traditional joining techniques in terms of interfacial brittleness and geometric constraints, this study employs Laser Powder Bed Fusion (LPBF) technology, specifically multi-material LPBF (MM-LPBF). By precisely melting IN718 and CuSn10 powders layer by layer, the study directly fabricates multi-material IN718/CuSn10 joint specimens, thereby simplifying the complexity of traditional joining processes. The research systematically investigates the interfacial microstructure and mechanical property evolution laws and underlying mechanisms. It reveals that sufficient element diffusion and hardness gradients are present at the IN718/CuSn10 interface, indicating good metallurgical bonding. However, due to significant differences in thermophysical properties, cracks inevitably appear at the interface. Mechanical property tests indicate that the strength of the IN718/CuSn10 joint specimens falls between that of IN718 and CuSn10, but with lower elongation, and fractures primarily occur at the interface. This research provides theoretical support for establishing a process database for LPBF formed of nickel–copper heterogeneous materials, advancing the manufacturing technology of aerospace multi-material components. Full article

As semiconductor packaging technologies face limitations, through-silicon via (TSV) technology has emerged as a key solution to extending Moore’s law by achieving high-density, high-performance microelectronics. TSV technology enables enhanced wiring density, signal speed, and power efficiency, and offers significant advantages over traditional wire-bonding techniques. However, achieving fine-pitch and high-density interconnects remains a challenge. Solder flip-chip microbumps have demonstrated their potential to improve interconnect reliability and performance. However, the environmental impact of lead-based solders necessitates a shift to lead-free alternatives. This review highlights the transition from Sn-Pb solders to lead-free options, such as Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Zn, and Bi- or In-based alloys, driven by regulatory and environmental considerations. Although lead-free solders address environmental concerns, their higher melting points pose challenges such as thermal stress and chip warping, which affect device reliability. To overcome these challenges, the development of low-melting-point solder alloys has gained momentum. This study examines advancements in low-temperature solder technologies and evaluates their potential for enhancing device reliability by mitigating thermal stress and ensuring long-term stability. Full article

Mg-Cu bimetallic materials have been widely studied because of their low density, good electrical conductivity, and excellent hydrogen storage properties. However, the interface bonding strength of Mg/Cu is low. In this study, we examined the effect of hot-dip tin coating (HDTC) with copper (Cu) on the interfacial metallurgical bonds between AZ91D Magnesium (Mg) alloy and Cu composite casting. A transition layer composed of Mg₂Cu and MgCu₂ intermetallic compounds (IMCs) formed at the interface of the AZ91D/HDTC-Cu composite casting. However, the transition layer was about 1 μm at the AZ91D/Cu interface, mainly comprising Mg(Al, Cu)₂ IMC. Both the AZ91D/Cu and AZ91D/HDTC-Cu interfaces exhibited many labyrinthine Mg(Al, Cu)₂ IMCs and layer-like Mg₂(Al, Cu) IMCs. Moreover, the interfacial shear strength of the AZ91D/Cu was changed from 12.6 MPa to 52.4 MPa due to the solid solution of Sn atom and the precipitation of Mg₂Sn IMC at the interface after HDTC treatment. Meanwhile, the shear fracture surfaces are characterized by brittle fractures. Full article

A Babbitt alloy SnSb11Cu6 with 0–2.0 wt.% Co was synthesized using the induction melting process. This study examined the effect of cobalt (Co) on the microstructure, tensile properties, compressive properties, Brinell hardness, and wear properties of SnSb11Cu6 using optical microscopy (OM), scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), X-ray diffraction (XRD), a universal tensile testing machine, a Brinell hardness tester, and a wear testing machine. The results indicate that the optimal quantity of Co can enhance the microstructure of the Babbitt alloy and promote microstructure uniformity, with presence of Co₃Sn₂ in the matrix. With the increase in Co content, the tensile and compressive strength of the Babbitt alloy first increased and then decreased, and the Brinell hardness gradually increased with the increase in Co content. The presence of trace Co has a minimal effect on the dry friction coefficient of the Babbitt alloy. When the Co content exceeds 1.5 wt.%, the friction properties of the Babbitt alloy deteriorate significantly. The optimized Babbitt alloy SnSb11Cu6-1.5Co was subsequently fabricated into wires, followed by conducting cold metal transfer (CMT) surfacing experiments. The Co element can promote the growth of interfacial compounds. The microstructure at the interface of the Babbitt alloy/steel is dense, and there is element diffusion between it. The metallurgical bonding is good, and there are serrated compounds relying on the diffusion layer to extend to the direction of the additive layer with serrated compounds extending and growing from the diffusion layer to the additive layer. Overall, Babbitt alloys such as SnSb11Cu6 exhibit improved comprehensive properties when containing 1.5 wt.% Co. Full article