Topic Editors

Dr. Shoue Chen
School of Packaging, Michigan State University, East Lansing, MI 48824, USA
Lewis Katz School of Medicine, Temple University, Philadelphia, PA 10140, USA
Dr. Ke Xie
Department of Chemistry, Northwestern University, Evanston, IL 60208, USA

Advanced Integrated Circuit Design and Application

Abstract submission deadline
30 October 2024
Manuscript submission deadline
28 February 2025
Viewed by
193

Topic Information

Dear Colleagues,

Advanced integrated circuits (ICs) are the keystones of modern electronics, playing a significant role in enabling the development of increasingly powerful, efficient, and versatile electronic devices and systems that renovate our living styles. Among the vast industries and technologies, the application of electronic engineering and IC system design to solve challenges in medical and biological fields has placed this field at the forefront of research and innovation. The potential intersection of biology, medicine, and electrical engineering will have a profound impact on modern healthcare, treatment, and diagnoses of diseases. In addition, owing to the continuous development of smart functional materials and electronics, advanced ICs could be imparted with intelligence and versatile sensory abilities. The ability to build IC systems, especially by combining solid-state electronics with the unique capabilities of bioinspired components, exhibits great promise, along with other innovations in advanced IC designs. The main technical challenges for advanced ICs involve how to construct units with improved performance, lower power consumption, enhanced reliability, smaller footprint, and possibility for new applications. Thus, the developments of emerging IC technologies have been focused on introducing novel device structures, new semiconducting materials, and new architecture to improve performance/integration density and enhance the function of ICs.

We encourage the submissions of original research studies and reviews on novel emerging material technologies—such as zero-dimensional, one-dimensional, two-dimensional, and three-dimensional nanostructured materials; smart and active materials for IC development; flexible thin-film IC designs; IC packaging; smart power ICs; and energy harvesting technologies—and their broad applications in next-generation wearables, health monitoring, as well as touch-sensing and other sensory systems.

Dr. Shoue Chen
Dr. Xiaolong Wang
Dr. Ke Xie
Topic Editors

Keywords

  • transistor
  • semiconductor
  • interface ICs
  • flexible ICs
  • IC packaging
  • nanomaterial
  • bioinspired electronics
  • sensing
  • energy harvesting
  • wearables

Participating Journals

Journal Name Impact Factor CiteScore Launched Year First Decision (median) APC
Electronics
electronics
2.6 5.3 2012 16.8 Days CHF 2400 Submit
Eng
eng
- 2.1 2020 28.3 Days CHF 1200 Submit
Journal of Low Power Electronics and Applications
jlpea
1.6 3.6 2011 23.2 Days CHF 1800 Submit
Micromachines
micromachines
3.0 5.2 2010 17.7 Days CHF 2600 Submit
Nanomaterials
nanomaterials
4.4 8.5 2010 13.8 Days CHF 2900 Submit

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