Process Monitoring and Fault Diagnosis
A special issue of Processes (ISSN 2227-9717). This special issue belongs to the section "Process Control and Monitoring".
Deadline for manuscript submissions: closed (31 May 2023) | Viewed by 19561
Special Issue Editor
Special Issue Information
Dear Colleagues,
The topic of “Process Monitoring and Fault Diagnosis” has emerged and become a hot research spot since the end of last century. With the development of data-acquiring technology, the amount of data collected from process industry has increased dramatically, essentially containing almost all information regarding both process operation and equipment condition, but the actual industrial situation has created a great challenge to both academia and industry due to frequent adjustments of operation and gradual changes of equipment condition, which leave us with an embarrassing dichotomy of rich data and poor information.
Recent development in all fields related to this topic, including but not limited to chemical engineering, data acquisition, data analysis, pattern recognition, information theory, and machine learning, has provided a good opportunity to tackle this problem.
The aim of this issue is to present methodological, theoretical, and practical developments related to “Process Monitoring and Fault Diagnosis”. Potential topics include but are not limited to the following:
- Early detection of process abnormality in industrial practice;
- Feature extraction of normality under multi-steady and non-steady states;
- Dynamics feature extraction under different control strategies;
- Root cause identification based on both process knowledge and data analytics;
- Integration of first principle model and data information;
- Application of machine learning methods;
- Soft sensor development;
- Data processing for feature extraction;
- Bottleneck analysis based on multiscale process data analysis;
- New method for batch process monitoring;
- Modeling and analysis of non-stationary signals;
- Metrics for fault detection.
Prof. Dr. Wei Sun
Guest Editor
Manuscript Submission Information
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